Abstract:Background: The demand for high-performance semiconductor products has led to reduced wafer feature size, lowered package size, and an ever-thinner die for advanced three-dimensional (3D) packaging. Dies down to a thickness of 5 μm have been demonstrated. One significant barrier is the fragility of the thin dies, their overall thin form factor, and their impact on yield, reliability, and costs.Aim: We explore the current state of the art in the current crack stop and outline the shortcomings moving forward for… Show more
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