We achieved a current gain cutoff frequency ( f T ) of 310 GHz at a cryogenic temperature (16 K) in a 195-nm-long gate In 0:75 Ga 0:25 As/In 0:52 Al 0:48 As high-electron-mobility transistor (HEMT) fabricated on a (411)A-oriented InP substrate. This is 27% higher than that at room temperature (245 GHz). For a corresponding HEMT fabricated on a (100) InP substrate, f T of 268 GHz was also obtained at 16 K, which is 15% higher than that obtained at 300 K (233 GHz). For both (411)A and (100) HEMTs, this significant enhancement in low-temperature f T s was caused by the increased average electron velocity under the gate (v ave ), which was mainly due to the suppression of phonon scattering. Furthermore, f T as high as 310 GHz was attributed to v ave of up to 4:9 Â 10 7 cm/s at 16 K for the (411)A HEMTs. This is higher than that of the (100) HEMTs (4:5 Â 10 7 cm/s) and is due to the reduced interface roughness scattering of electrons caused by (411)A super-flat InGaAs/InAlAs interfaces (effectively atomically flat heterointerfaces over a wafer-size area).