Suppression of leakage current in Schottky barrier metal-oxide-semiconductor field-effect transistorsA study on the capacitance-voltage characteristics of metal-Ta 2 O 5 -silicon capacitors for very large scale integration metal-oxide-semiconductor gate oxide applications A memory cell with single-electron and metal-oxide-semiconductor transistor integration Si field emitter arrays ͑FEAs͒ were monolithically integrated with metal-oxide-semiconductor field-effect-transistor ͑MOSFET͒ based driving circuits on a Si chip for the first step toward developing the field-emission-display-on-a-chip ͑FED-on-a-chip͒, which is a candidate for the next-generation FED. We developed a fabrication process of Si FEAs integrated with MOSFET driving circuits. A 4ϫ4 matrix Si FEA, emission-control MOSFET, and simple driving circuits consisting of a shift register were integrated on the same chip. The operation of each element, such as MOSFET-controlled Si FEAs and logic circuits for the driver, was confirmed. The emission current from the Si FEA can be controlled by the built-in MOSFET at a voltage of less than 5 V, which can be driven by the built-in driving circuits. The operation of the 4ϫ4 matrix FEA with driving circuits was demonstrated. This is the first operation of the FEA integrated with MOSFET logic circuits. The detailed design and fabrication processes are described.