Optimization of front surface texturing processes for high-efficiency silicon solar cells

Manea, E.; Budianu, E.; Purica, M.; Cristea, Dana; Cernica, I.; Müller, Raluca; Poladian, V. Moagar

doi:10.1016/j.solmat.2004.06.013

Cited by 41 publications

(16 citation statements)

References 4 publications

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“…The alkaline solution containing sodium hydroxide (NaOH) and isopropyl alcohol (IPA) is widely used in industrial batch process [5]. Normally the average pyramid size is varying from 2 m to 8 m, and the corresponding reflectivity is in the range of 14-15% [6][7][8][9]. To maintain stability during the texturing process, IPA must be added to the solution frequently to keep it in the same concentration because of the evaporation of IPA.…”

Section: Introductionmentioning

confidence: 99%

Formation of Various Pyramidal Structures on Monocrystalline Silicon Surface and Their Influence on the Solar Cells

Han

Wang

et al. 2013

Journal of Nanomaterials

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Texturization is a useful method to enhance the optical absorption of monocrystalline silicon wafers by light-trapping effect in solar cell processing. In present study, a series of textured wafers with various pyramid sizes ranging from 200 nm to 10 m were fabricated by modified wet-chemical method and characterized. The results show that there is little difference in the reflectance with the pyramid sizes from 1 to 10 m, which is consistent with the ray-tracing simulation results. However, the light-trapping function of the 200 nm sample below the geometrical optics limit is much weaker. The solar cells fabricated from the 1 m samples own the highest power conversion efficiency of 18.17% due to a better coverage of metal finger lines than the larger ones, and the 200 nm samples have the lowest efficiency of 10.53%.

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Section: Introductionmentioning

confidence: 99%

Formation of Various Pyramidal Structures on Monocrystalline Silicon Surface and Their Influence on the Solar Cells

Han

Wang

et al. 2013

Journal of Nanomaterials

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“…Packing problem can be mapped to the field of sensor manufacturing [14][15][16]. In this case, packing is a problem of producing sensors from a circular silicon wafer which is a fixed-size container.…”

Section: Introductionmentioning

confidence: 99%

On Calculating the Packing Efficiency for Embedding Hexagonal and Dodecagonal Sensors in a Circular Container

Prvan

Ožegović

Mišura

2019

Mathematical Problems in Engineering

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In this paper, a problem of packing hexagonal and dodecagonal sensors in a circular container is considered. We concentrate on the sensor manufacturing application, where sensors need to be produced from a circular wafer with maximal silicon efficiency (SE) and minimal number of sensor cuts. Also, a specific application is considered when produced sensors need to cover the circular area of interest with the largest packing efficiency (PE). Even though packing problems are common in many fields of research, not many authors concentrate on packing polygons of known dimensions into a circular shape to optimize a certain objective. We revisit this problem by using some well-known formulations concerning regular hexagons. We provide mathematical expressions to formulate the difference in efficiency between regular and semiregular tessellations. It is well-known that semiregular tessellation will cause larger silicon waste, but it is important to formulate the ratio between the two, as it affects the sensor production cost. The reason why we have replaced the “perfect” regular tessellation with semiregular one is the need to provide spacings at the sensor vertices for placing mechanical apertures in the design of the new CMS detector. Archimedean {3,122} semiregular tessellation and its more flexible variants with irregular dodecagons can provide these triangular spacings but with larger number of sensor cuts. Hence, we construct an irregular convex hexagon that is semiregularly tessellating the targeted area. It enables the sensor to remain symmetric and hexagonal in shape, even though irregular, and produced with minimal number of cuts with respect to dodecagons. Efficiency remains satisfactory, as we show that, by producing the proposed irregular hexagon sensors from the same wafer as a regular hexagon, we can obtain almost the same SE.

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“…Crystalline silicon's light trapping is realized mainly by surface texturing which can generate light scattering, a decrease of the light loss can be obtained by the multiple reflections. *kinggold1986@163.com phone 0312-5079560; fax 0312-5079560 Recent years, the fabrication of submicron periodic substrate has been developed rapidly in the research of the thin film solar cells [2][3] [4] . The submicron light trapping structure can be obtained by using photoetching or nanoimprint technology in which submicron periodic patterns are used as the mask blank, patterns can be fabricated by electronic sculpture or nanoimprint lithography etc.…”

Section: Introductionmentioning

confidence: 99%

Si surface texture by pyramid structure ZnO glass mask blank

et al. 2013

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In this work, a textured surface structure of Si substrate has been prepared using pyramid structure ZnO glass as mask, and the structure of textured surface and reflection characteristics of Si substrate have been analyzed by scanning electron microscope (SEM) and reflectivity spectra. The results show that U-shaped structure is formed on the surface of photoresist after the incidence of ultraviolet light, and it is caused by the different decrement of light intensity in the ZnO glass Mask Blank. The U-shaped structure which is same with the photoresist appears at the surface of Si substrate after reactive ion etching (RIE) process, and the size of U-shaped structure is in the range of 0.5-1.5 μm. Needle-like morphology caused by the RIE process appears on the U-shaped structure. The reflectivity of the U-shaped Si surface is decreased by the needle-like morphology, and it is protected by the U-shaped structure. The textured structure etched at different pressure is further investigated, and the results suggest that the reflectance of the sample reduces firstly and then increases with the decrease of pressure, and a minimal average reflectance is obtained at 0.8 Pa. The ion damage of Si surface is reduced in the second texturing process, which is useful for film deposition. The results suggest that low reflectance and textured surface of Si substrate can be obtained by ZnO glass mask blank with natural pyramid structure, which is meaningful for light trapping in solar cells.

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Optimization of front surface texturing processes for high-efficiency silicon solar cells

Cited by 41 publications

References 4 publications

Formation of Various Pyramidal Structures on Monocrystalline Silicon Surface and Their Influence on the Solar Cells

Formation of Various Pyramidal Structures on Monocrystalline Silicon Surface and Their Influence on the Solar Cells

On Calculating the Packing Efficiency for Embedding Hexagonal and Dodecagonal Sensors in a Circular Container

Si surface texture by pyramid structure ZnO glass mask blank

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