Optimization of Electric-Field Grading Plates in a PCB-Integrated Bus Bar for a High-Density 10 kV SiC MOSFET Power Module

Field Plate Integration for Mitigating Partial Discharge Activity in PCB-Embedded Power Electronic Modules

“…These geometrical singularities, largely studied in the literature [5], induce a clear voltage withstand issuei.e., presence of partial discharges (PDs) and possible breakdown voltage (BDV)-that needs to be considered during the electrical design phase. The literature presents several techniques to manage the electric field reinforcement at the triple point [6]. For instance, Waltrich et al [7] propose applying a dielectric coating to reduce the electric field at this location.…”

“…A solution developed in [10,11] for high-voltage DC-link busbars lies in modifying the electric field configuration thanks to a capacitive field grading inside the PCB structure, with the advantage of a classical PCB manufacturing process. With this technique, the electric field reinforcement originally located at the triple point is reduced and transferred to another material with better dielectric rigidity than air, i.e., FR4 resin.…”

“…However, in the case of capacitive field grading dedicated to DC-link busbar applications, the studies are mainly focused on electric field management at the surface of the PCB. For instance, Cairnie et al [11] depict the electric field management of PCB busbars in the air with high voltage potentials at the surface of the PCB. Ravi et al [10] also study the electric field at the PCB surface with plated through hole (PTH), which connects both metallizations of PCBs.…”

“…Note that the power chips in Figure 2a are not considered in this study, and TOP and BOT FPs are only studied in a symmetrical configuration as a result of previous works [12]. The literature presents several techniques to manage the electric field reinforcement at the triple point [6]. For instance, Waltrich et al [7] propose applying a dielectric coating to reduce the electric field at this location.…”