A Tutorial on High-Density Power Module Packaging

Chen, Y.; Iradukunda, Ange-Christian; Mantooth, Alan; Chen, Zhong; Huitink, David

doi:10.1109/jestpe.2022.3232691

Cited by 10 publications

(2 citation statements)

References 52 publications

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“…Upcoming challenges: This review has characterised the main power device technologies suitable for HGV applications. Nevertheless, considering the converter implementation, other challenges include EMI/EMC [93][94][95], investigating the impact of high voltage commutation rates on motor insulation reliability [96][97][98], power module/converter designs involving multiple chips in parallel and optimised busbars [99][100][101], thermal management and increased power densities [102,103], short circuit detection [104,105] and application-specific qualification methodologies/guidelines, as suggested by the JEDEC JC-70 guidelines and the ECPE guidelines for the qualification of power modules used in motor vehicles (AQG 324) [106]. The increased commercial availability of higher voltage devices (1.7 kV to 3.3 kV rated) may open new avenues for higher voltage charger designs and even higher inverter bus voltages.…”

Section: Discussionmentioning

confidence: 99%

A Review of Power Electronic Devices for Heavy Goods Vehicles Electrification: Performance and Reliability

et al. 2023

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This review explores the performance and reliability of power semiconductor devices required to enable the electrification of heavy goods vehicles (HGVs). HGV electrification can be implemented using (i) batteries charged with ultra-rapid DC charging (350 kW and above); (ii) road electrification with overhead catenaries supplying power through a pantograph to the HGV powertrain; (iii) hydrogen supplying power to the powertrain through a fuel cell; (iv) any combination of the first three technologies. At the heart of the HGV powertrain is the power converter implemented through power semiconductor devices. Given that the HGV powertrain is rated typically between 500 kW and 1 MW, power devices with voltage ratings between 650 V and 1200 V are required for the off-board/on-board charger’s rectifier and DC-DC converter as well as the powertrain DC-AC traction inverter. The power devices available for HGV electrification at 650 V and 1.2 kV levels are SiC planar MOSFETs, SiC Trench MOSFETs, silicon super-junction MOSFETs, SiC Cascode JFETs, GaN HEMTs, GaN Cascode HEMTs and silicon IGBTs. The MOSFETs can be implemented with anti-parallel SiC Schottky diodes or can rely on their body diodes for third quadrant operation. This review examines the various power semiconductor technologies in terms of losses, electrothermal ruggedness under short circuits, avalanche ruggedness, body diode and conduction performance.

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Section: Discussionmentioning

confidence: 99%

A Review of Power Electronic Devices for Heavy Goods Vehicles Electrification: Performance and Reliability

et al. 2023

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“…Moreover, there is an emerging ambition to reduce the weight and size of the power modules and, subsequently, their cost. Combined, these two ideas introduce the concept of high voltage correlated with high power density [3].…”

Section: Introductionmentioning

confidence: 99%

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Adhikari,

Ghassemi

2024

IEEE Trans. Dielect. Electr. Insul.

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Within the expanding domain of electrical power demand, the future of power module packaging is entwined with the progress of (ultra) wide bandgap (UWBG) materials. These materials, like silicon carbide (SiC), aluminum nitride (AlN), and diamond, offer advantages with higher power density, decreased weight, and expanded operational abilities regarding temperature, voltage, and frequency. However, the pursuit of pushing these limits confronts challenges within insulation systems, which may struggle to endure the demands of these parameters, potentially resulting in unfavorable conditions like high electric field, space charge accumulation, electrical treeing, and partial discharge (PD), leading to insulation failure. The emphasis of this paper is to review the insulation challenges within (U)WBG power modules and recent research in mitigating the electric field stress at triple points (TPs) and resolving the PD issues. The manuscript first discusses the high electric field stress issue at triple points. Then, ceramic substrate materials, encapsulation materials, and the influence of harsh weather conditions on them are reviewed. The space charge, electrical treeing, and PD issues within encapsulation materials are analyzed under practical operation conditions of (U)WBG power modules like high frequency, temperature, and square wave pulses. Finally, the various strategies to alleviate the associated insulation challenges are meticulously discussed. While the identified mitigation strategies are able to strengthen insulation systems for packaging, their validation under actual operational conditions of (U)WBG power modules remains relatively unexplored, representing a potential avenue for further investigation. This review offers a valuable framework by providing the constraints of the current studies and recommendations for the future that can be utilized as a reference point for future research endeavors. Index Terms-(U)WBG power module packaging, partial discharge, triple points, encapsulation material, electric field stress, high power density, field grading materials, nonlinear field-dependent conductivity layerThis paragraph of the first footnote will contain the date on which you submitted your paper for review, which is populated by IEEE.

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Methods for increasing the Partial Discharge Inception Voltage of Power Module Substrates using Guard Ring Structures

Gao,

Uhrenfeldt,

Munk-Nielsen

et al. 2024

2024 IEEE Applied Power Electronics Conference and Exposition (APEC)

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A Tutorial on High-Density Power Module Packaging

Cited by 10 publications

References 52 publications

A Review of Power Electronic Devices for Heavy Goods Vehicles Electrification: Performance and Reliability

A Review of Power Electronic Devices for Heavy Goods Vehicles Electrification: Performance and Reliability

A Comprehensive Review of Mitigation Strategies to Address Insulation Challenges within High Voltage, High Power Density (U)WBG Power Module Packages

Methods for increasing the Partial Discharge Inception Voltage of Power Module Substrates using Guard Ring Structures

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