Optimising dynamic behaviour of electrostatically actuated MEMS contact switch

Lishchynska, Maryna; Cychowski, Marcin; Canty, Niel; O'Mahony, Tom; Delaney, Kieran

doi:10.1109/esime.2009.4938463

Cited by 6 publications

(3 citation statements)

References 12 publications

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“…Figure 13 shows time-scale waveform with driving voltage of 28 V and 10 6 cycles. Voltage drops in the beginning of each period indicate the contactbouncing phenomenon [49][50][51].…”

Section: Dynamic Performance and Life Timementioning

confidence: 99%

Low voltage, high speed and small area in-plane MEMS switch

Bian

Zhao

You

2019

J. Micromech. Microeng.

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Electrostatic in-plane microelectromechanical systems (MEMS) relays/switches are widely applied for their low power consumption and simple process. However, compared to the out-ofplane designs, in-plane designs usually suffer from high pull-in voltage, since the feature size of the bulk-silicon process limits the gap between the driving electrodes. Area cost and speed usually have to be sacrificed to enhance the driving force and decrease the pull-in voltage.Balancing the pull-in voltage, speed and area cost is difficult for MEMS relays/switches but is essential in many practical applications. Comb structure is promising to relieve this contradiction. In this paper, we integrated the comb structure with the cantilever structure. As a result, the pull-in voltage decreased with the decreasing of the mass and area cost. A novel electrostatic lateral MEMS switch was introduced. The experiments have shown that 12 V pull-in voltage, 120 µs switching time with a 28 V driving voltage at atmospheric pressure, and small area were fabricated using a conventional bulk-silicon process.

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“…Figure 13 shows time-scale waveform with driving voltage of 28 V and 10 6 cycles. Voltage drops in the beginning of each period indicate the contactbouncing phenomenon [49][50][51].…”

Section: Dynamic Performance and Life Timementioning

confidence: 99%

Low voltage, high speed and small area in-plane MEMS switch

Bian

Zhao

You

2019

J. Micromech. Microeng.

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“…Guo et al [6] implemented a purely elastic contact behavior with Johnson-Kendall-Roberts (JKR) adhesion model using a finite element method in ANSYS. Lishchynska et al [9] employed linear and piece-wise linear system identification techniques to model the switch and then developed a closedloop controller to optimize the switch operation in the offstate. But the linearized system does not cover precisely the bouncing behaviour of the switch.…”

Section: Introductionmentioning

confidence: 99%

Integrated modeling of nonlinear dynamics and contact mechanics of electrostatically actuated RF-MEMS switches

Cychowski

Lishchynska

et al. 2010

IECON 2010 - 36th Annual Conference on IEEE Industrial Electronics Society

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In this work, a novel nonlinear dynamic model is developed to investigate the bouncing and deformation behaviors of an electrostatically actuated, ohmic-contact RF-MEMS switch. The model accounts for a real geometry, the electrostatic actuation, squeeze-film damping effect, and the nonlinear elastic-plastic contact mechanics using Hertz theory. A lowcomplexity formulation based on finite differential analysis is employed to solve the model equations in the time-domain. The proposed methodology is validated using a real four-contact RF-MEMS switch with complex geometry. The simulation results of the switch performance in the on-stage (closure) are in good agreement with experimental measurements demonstrating that the model is very effective in capturing the bouncing and contact deformation phenomena accurately. It is foreseen that the proposed approach will be instrumental in providing a better insight into the reliability of MEMS switches and will, ultimately, found a basis of developing and implementing control strategies to maximize their lifetime.

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“…This approximation is used because the authors focused their attention on electrostatic-structural interaction with a purpose of designing actuation waveform that would completely eliminate contact bouncing. FE analysis is also used by Lishchynska et al in an attempt to simulate bouncing effect in a microswitch [ 20 ]. Air damping is not considered by the authors, which simulate electromechanical behavior and propose effective voltage controller scheme for stabilizing off-stage oscillations.…”

Section: Introductionmentioning

confidence: 99%

Numerical Analysis of Dynamic Effects of a Nonlinear Vibro-Impact Process for Enhancing the Reliability of Contact-Type MEMS Devices

Ostaševičius

Gaidys

Daukševičius

2009

Sensors

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This paper reports on numerical modeling and simulation of a generalized contact-type MEMS device having large potential in various micro-sensor/actuator applications, which are currently limited because of detrimental effects of the contact bounce phenomenon that is still not fully explained and requires comprehensive treatment. The proposed 2-D finite element model encompasses cantilever microstructures operating in a vacuum and impacting on a viscoelastic support. The presented numerical analysis focuses on the first three flexural vibration modes and their influence on dynamic characteristics. Simulation results demonstrate the possibility to use higher modes and their particular points for enhancing MEMS performance and reliability through reduction of vibro-impact process duration.

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Optimising dynamic behaviour of electrostatically actuated MEMS contact switch

Cited by 6 publications

References 12 publications

Low voltage, high speed and small area in-plane MEMS switch

Low voltage, high speed and small area in-plane MEMS switch

Integrated modeling of nonlinear dynamics and contact mechanics of electrostatically actuated RF-MEMS switches

Numerical Analysis of Dynamic Effects of a Nonlinear Vibro-Impact Process for Enhancing the Reliability of Contact-Type MEMS Devices

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