Optimally selecting packaging technologies and circuit partitions based on cost and performance

Jacobsen, John Bjerregaard; Hopkins, Douglas C.

doi:10.1109/apec.2000.826079

Cited by 8 publications

(1 citation statement)

References 2 publications

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“…Therefore, the initial substrate cost might be higher but the component and assembly cost might justify the use of these technologies. Reference [11] gives a comparison of a number of technologies from the cost viewpoint.…”

Section: Design Process For High Integration Levelmentioning

confidence: 99%

Converter Concepts to Increase the Integration Level

Popović

Ferreira

2005

IEEE Trans. Power Electron.

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Abstract-In the previous work, a way to improve packaging of power electronic converters by increasing integration level and using multifunctional construction parts is presented. The quantities intended to evaluate integration level and volumetric utilization in power converters are introduced. Based on these values, a number of methods to increase the integration level are presented. A design process in the form of a flow chart that implements these methods in concrete design problems is presented.In this paper, the design process is applied to a dc/dc 42/14-V converter for automotive applications. Utilizing commercially available technologies that lend themselves to mass production this design process results in three packaging concepts, namely lead frame converter, printed circuit board embedded converter, and heat conductor converter. These concepts are then compared to a benchmark converter implemented in the conventional, discrete packaging technology. It is shown that by smart use of parts in the converter construction, the high values of integration level and high power densities can be achieved.Index Terms-Heat conductor converter, lead frame converter, power electronic converters, printed circuit board (PCB).

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Section: Design Process For High Integration Levelmentioning

confidence: 99%