Converter Concepts to Increase the Integration Level

Popović, Jelena; Ferreira, J.A.

doi:10.1109/tpel.2005.846555

Cited by 17 publications

(5 citation statements)

References 18 publications

(18 reference statements)

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“…Figure 7 depicts the topology of such converter and a possible 3D integrated assembly. Isolated supplies based on discrete components can be more efficient but require specific designs [23]. Besides, their robustness may affect the global reliability of the converter if it is not integrated.…”

Section: B Isolated Gate Driver Power Suppliesmentioning

confidence: 99%

Implementation and operational investigations of bipolar gate drivers

Crébier

Tran

Barbaroux

et al. 2010

2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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Abstract-This paper deals with the investigation of simple implementation and design of bipolar gate driver for high side power transistor control. Bipolar gate signals are usually preferred for high switching dynamic control and power device shielding. Nevertheless, bipolar supplies are harder to implement and rely on numerous components that may result in significant reduction of overall converter robustness. An alternative solution is to use unipolar supplies which are more complex but integrable with specific gate driver circuits. The addition of resonant structure gives the possibilities for involving the efficiency of the gate driver and reducing further gate driver supply requirements. The paper presents theses issues based on several gate drivers and their supplies.

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Section: B Isolated Gate Driver Power Suppliesmentioning

confidence: 99%

Implementation and operational investigations of bipolar gate drivers

Crébier

Tran

Barbaroux

et al. 2010

2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)

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“…The values of integration level ( and ), volumetric packaging efficiency and power density are calculated and the best design is chosen. The implementation of this design process is shown on a case study in [20].…”

Section: Power Module On Lead Frame [16]mentioning

confidence: 99%

An Approach to Deal With Packaging in Power Electronics

Popović

Ferreira

2005

IEEE Trans. Power Electron.

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Abstract-Current packaging technology in power electronics is based on assembling pre-manufactured discrete components. Each component consists of a number of parts, manufactured in a variety of manufacturing processes. This has resulted in a diversity of construction parts and mutually incompatible manufacturing processes in a typical power electronic converter and has brought power electronics to the edge where it becomes extremely difficult to reduce the cost and size of power electronic converters. This also makes integration of power electronic converters difficult.In this paper, we present a way to improve the physical construction of power electronic converters by increasing level of integration and using multifunctional construction parts. integration and packaging are two important aspects of physical construction of power electronic converters. Both of them and their mutual relationship are discussed in the paper. Three quantities intended to evaluate integration level and volumetric utilization namely functional elements integration level, ; packaging elements integration level ; and volumetric packaging efficiency v are introduced. Based on these values, a number of techniques to increase the integration level are presented. A design process in the form of a flowchart intended to implement these techniques in concrete design cases is presented.Index Terms-Functional elements (FEs) integration level, packaging elements (PEs) integration level, power electronic converters, volumetric packaging efficiency.

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“…The integration of passive components is a key enabler for high-power-density power supply [1], [2]. The low-cost printed circuit board (PCB) is the most widely used substrate material in electronic applications.…”

Section: Introductionmentioning

confidence: 99%

2 MHz high-density integrated power supply for gate driver in high-temperature applications

Perrin

Allard

Buttay

et al. 2016

2016 IEEE Applied Power Electronics Conference and Exposition (APEC)

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International audienceA PCB embedded transformer for harsh environment (i.e., ambient temperature above 200 • C) applications is presented and used in the design of a 2 MHz integrated power-supply prototype for gate driver. The main benefits of using this developed PCB embedding process are the capability to customize the air-gap for the flyback transformer and volume reduction for the converter. The easy modulation of the air-gap distance can be achieved using PCB material in specfic thickness. Moreover, the design of a coplanar-winding transformer structure with very low inter-winding capacitance needs a large winding area and raises the interest for the PCB integration approach. Two-machined ferrite pieces in UI shape were sandwiched into a multi-layer PCB laminate with multiple pressing processes. A converter prototype built with the PCB embedded transformer and other components (GaN transistors, gate driver and passives) mounted above it shows 72% of power efficiency. One thousand thermal cycles between −55 • C and 200 • C were performed on the PCB embedded transformer without observation of any major defects, such as delamination and cracking. The thermal reliability test validates the compatibility between the selected ferrite core and PCB materials as well as the feasibility of this developed transformer embedding method. A three-time volume reduction is achieved when comparing with a benchmark converter prototype using discrete transformer

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Converter Concepts to Increase the Integration Level

Cited by 17 publications

References 18 publications

Implementation and operational investigations of bipolar gate drivers

Implementation and operational investigations of bipolar gate drivers

An Approach to Deal With Packaging in Power Electronics

2 MHz high-density integrated power supply for gate driver in high-temperature applications

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