Optical interconnect modules for high-speed backplane applications

Glebov, Alexei L.; Lee, M.G.; Yokouchi, Kishio

doi:10.1109/cleoe.2005.1568253

Cited by 3 publications

(4 citation statements)

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“…Previously, different techniques such as, 45 -ended waveguide with active interposer or pillar [8], [9], 45 -ended connection rods [10], microlens [3], [11], [12], microprisms [13], 45 -ended waveguide with 3-D optical interconnects [4], [5], etc., have been explored to couple the optical signal. These methods can provide a good optical coupling efficiency, but they require the use of additional micro-optics components or interconnection modules, which involve either extra costly components or tedious assembly process.…”

Section: Introductionmentioning

confidence: 99%

“…Currently, polymer based waveguide is the most popular choice for optical interconnect due to its low cost, high thermal stability, low optical loss, and suitability for mass production. The typical loss for the waveguide used in optical/electrical circuit board (OECB), depending on the fabrication process, materials, and its cross sectional area, range from 0.05 to 0.6 dB/cm [3]- [7]. Depending on the fabrication process and materials, polymer properties can have a thermal stability of over a temperature of 250 C. The vertical-cavity-surface-emitter lasers (VCSEL) is an attractive optical source for optical interconnect applications.…”

Section: Introductionmentioning

confidence: 99%

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Demonstration of Direct Coupled Optical/Electrical Circuit Board

Lim

Ramana

Lee

et al. 2009

IEEE Trans. Adv. Packag.

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We report the development of a low cost, simple optical/electrical circuit board (OECB) using multimode polymer waveguide on FR4 printed circuit board (PCB). The design of this OECB uses only a 45 -ended waveguide to couple and decouple the optical signal directly between the optical devices and the waveguide. The 45 mirror is formed using excimer laser process on a multimode waveguide with temperature stability at reflow temperature. The optical waveguide is attached to a diced channel in the FR4 PCB using adhesive to form a completely planar circuit. This allows the laser diode and the photodiode to be assembled directly above the input and output of the waveguide using precision flip chip technology, which provides good alignment accuracy. This helps to increase the mechanical reliability of the circuit and minimize assembly requirements. Most importantly, all the electronic and optoelectronic devices used are commercially available components. In the paper, we report the details of the design, simulation result, and the testing results.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Demonstration of Direct Coupled Optical/Electrical Circuit Board

Lim

Ramana

Lee

et al. 2009

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

show abstract

“…Currently, polymer based waveguide is the most popular choice for optical interconnect due to its low cost, high thermal stability, low optical loss and suitability for mass production. The typical loss for the waveguide used in OECB, depending on the fabrication process, materials and its cross sectional area, range from 0.05dB/cm to 0.6dB/cm [3]- [7]. Depending on the fabrication process and materials, polymer properties can have a thermal stability of over a temperature of 250°C.…”

Section: Introductionmentioning

confidence: 99%

“…Previously, different techniques such as, 45°-ended waveguide with active interposer or pillar [8], [9], 45°-ended connection rods [10], microlens [3], [11], microprisms [12], 450-ended waveguide with 3D optical interconnects [4], [5] etc. have been explored to couple the optical signal.…”

Section: Introductionmentioning

confidence: 99%

Demonstration of High Frequency Data Link on FR4 Printed Circuit Board Using Optical Waveguides

Lim

Lee

Shioda

et al. 2007

2007 Proceedings 57th Electronic Components and Technology Conference

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We report the development of a low cost, simple optical circuit board (OECB) using large core Multi Mode polymer waveguide on FR4 printed circuit board (PCB). The design of this OECB uses only a 45°-ended waveguide to couple and decouple the optical signal directly between the optical devices and the waveguide. The 45°mirror is formed using excimer laser process on a multi mode waveguide with temperature stability at reflow temperature. The optical waveguide is attached to a diced channel in the FR4 PCB using adhesive to form a completely planar circuit. This allows the laser diode and the photodiode to be assembled directly above the input and output of the waveguide using precision flip chip technology, which provides good alignment accuracy. This helps to increase the mechanical reliability of the circuit and minimize assembly requirements. Most importantly, all the electronic and optoelectronic devices used are commercially available components, the FR4 PCB fabrication process is standard process, the component assembly process is normal reflow process and the method is amenable for manufacturing. In the present publication, we report the details of the design, assembly process, high accuracy optical device attachment, performance characterization and testing results.

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