Optical backplane demonstrators based on FET-SEED smart pixel arrays

Plant, David V.; Robertson, Brian; Hinton, H.S.; Robertson, W. M.; Boisset, G.C.; Kim, N.H.; Liu, Y.S.; Otazo, M.R.; Rolston, D.R.; Shang, A.Z.; Sun, Lu

doi:10.1109/leos.1994.586981

Cited by 4 publications

(2 citation statements)

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“…Optical interconnection has been widely agreed as a better alternative to upgrade the system performance. However, reliability and packaging compatibility of many demonstrated optical interconnect systems [4]- [6] have impeded the integration of optical interconnect into a real system. For example, the board-level optical interconnections reported in [4] are all using hybrid approach where both electronic and optoelectronic components are located at the surface of the board.…”

Section: Introductionmentioning

confidence: 99%

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Fully embedded board-level guided-wave optoelectronic interconnects

Chen¹,

Lin²,

Choi³

et al. 2000

Proc. IEEE

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187

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Section: Introductionmentioning

confidence: 99%

“…Such an approach makes the packaging difficult and costly. Furthermore, the employment of free space instead of guided-wave optical interconnection reported in [4]- [6] makes the system vulnerable in harsh environment.…”

Section: Introductionmentioning

confidence: 99%

Fully embedded board-level guided-wave optoelectronic interconnects

Chen¹,

Lin²,

Choi³

et al. 2000

Proc. IEEE

Self Cite

187

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An optical backplane demonstrator system based on FET-SEED smart pixel arrays and diffractive lenslet arrays

Plant

Robertson

Hinton

et al. 1995

IEEE Photon. Technol. Lett.

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We have demonstrated a representative portion of an optical backplane using FET-SEED smart pixels and freespace optics to interconnect Printed Circuit Boards (PCB's) in a two board, unidirectional link configuration. 4 x 4 arrays of FET-SEED transceivers were designed, fabricated, and packaged at the PCB level. The optical interconnection was constructed using diffractive microoptics, and custom optomechanics. The system was operated in two modes, one showing high data throughput, 100 MBWsec, and the other demonstrating large connection densities, 2222 channel/cm"

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