Ontology for the anisotropic conductive adhesive interconnect technology for electronics packaging applications

Ontologies for Industry 4.0

“…For this purpose, in the last decade, ontologies have been developed for one specific industrial domain such as aviation (Keller, 2016), aeropsace (Kossmann et al, 2009), construction (Liao et al, 2009), steel production (Dobrev et al, 2008), chemical engineering (Vinoth & Sankar, 2016;Feng et al, 2018), oil industry (Du et al, 2010;Guo & Wu, 2012), energy (Santos et al, 2018), and electronics (Liu et al, 2005a). Other ontologies have been used for one specific manufacturing process such as packaging (Liu et al, 2005b), process engineering (Wiesner et al, 2010), process compliance (Disi & Zualkernan, 2009), risk management (Atkinson et al, 2006), safety management (Hooi et al, 2012), customer feedback analysis (Kim and Lee, 2013;Daly et al, 2015), organizational management (Grangel-Gonzalez et al, 2016;Izhar and Apduhan, 2017), project management (Cheah et al, 2011), product development (Zhang et al, 2017), maintenance (Haupert et al, 2014), resource reconfiguration (Wan et al, 2018b), and production scheduling (Kourtis et al, 2019). Ontologies have also been focused on one service, for example, ticketing (Vukmirovic et al, 2006), or on one manufacturing concept, for example, information flow (Bildstein and Feng, 2018), information security (Mozzaquatro et al, 2016), and data integration (Yusupova et al).…”

Composite coating structure in an implantable electronic device

“…The flip chip joining can be made using anisotropically conductive adhesives (ACA). With this technology, fine‐pitch assembly, flexible and simple processing and low costs are achieved (Liu et al , 2005). The reliability of the adhesive joints is dependent on numerous considerations.…”