Influence of medical sterilization on ACA flip chip joints using conformal coating

Kokko, Kati; Harjunpää, Hanna; Heino, P.; Kellomäki, Minna

doi:10.1016/j.microrel.2008.10.016

Cited by 8 publications

(5 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Vaporized hydrogen peroxide (VH 2 O 2 ) sterilization is standardized under ISO 22441:2022 and is shown to have no effect on adhesion of bulk Parylene, making it suitable for wireless, battery-free conformal devices. ,, Irradiative sterilization broadly degrades Parylene, including crystalline structure modification, electron-beam induced scission, and γ-radiation-induced cross-linking. Some decrease in Parylene-to-metal adhesion is also observed in gamma ray sterilization. ,− Overall, autoclaving has the most destructive consequences, causing coating embrittlement and reducing Parylene adhesion to Parylene, metal, and other material. ,− This is due to Parylene’s glass transition temperature (90 °C) being significantly less than the autoclave temperature (121 °C). , While steam autoclaving and dry heat sterilization are incompatible with heat- and moisture-sensitive polymers, recent work demonstrates additives capable of reducing the impact of steam-heat and radiation degradation in certain hydrogels, making these methods potentially viable . As wireless, battery-free technology matures, there is space for exploration in new sterilization methods for this device class, as well as for sterilization-stable substrates and encapsulants which convey the numerous material advantages over metal and ceramic hermetic encapsulation.…”

Section: Sterilization Techniquesmentioning

confidence: 99%

Wireless Battery-free and Fully Implantable Organ Interfaces

Bhatia,

Hanna,

Stuart

et al. 2024

Chem. Rev.

View full text Add to dashboard Cite

Advances in soft materials, miniaturized electronics, sensors, stimulators, radios, and battery-free power supplies are resulting in a new generation of fully implantable organ interfaces that leverage volumetric reduction and soft mechanics by eliminating electrochemical power storage. This device class offers the ability to provide high-fidelity readouts of physiological processes, enables stimulation, and allows control over organs to realize new therapeutic and diagnostic paradigms. Driven by seamless integration with connected infrastructure, these devices enable personalized digital medicine. Key to advances are carefully designed material, electrophysical, electrochemical, and electromagnetic systems that form implantables with mechanical properties closely matched to the target organ to deliver functionality that supports high-fidelity sensors and stimulators. The elimination of electrochemical power supplies enables control over device operation, anywhere from acute, to lifetimes matching the target subject with physical dimensions that supports imperceptible operation. This review provides a comprehensive overview of the basic building blocks of battery-free organ interfaces and related topics such as implantation, delivery, sterilization, and user acceptance. State of the art examples categorized by organ system and an outlook of interconnection and advanced strategies for computation leveraging the consistent power influx to elevate functionality of this device class over current battery-powered strategies is highlighted.

show abstract

Section: Sterilization Techniquesmentioning

confidence: 99%

Wireless Battery-free and Fully Implantable Organ Interfaces

Bhatia,

Hanna,

Stuart

et al. 2024

Chem. Rev.

View full text Add to dashboard Cite

show abstract

Section: Substrates Printing Techniques and Post‐treatmentsmentioning

confidence: 99%

“…Conformal coatings were also produced by spray coating, dip coating, plasma deposition, and vacuum deposition techniques, among others. [292] Such conformal coatings, and different hybrid layers (namely SiO 2 ,TiO 2 , ZTO, or Al 2 O 3 ) can be used to protect flexorganic, and printed patterns. [293] Several other options have been developed based on dielectric polymers for encapsulation of PE devices, however there are still few studies regarding the results of the application of these materials in terms of protection from harsh environments.…”

Section: Coatingsmentioning

confidence: 99%

Advances in Printing and Electronics: From Engagement to Commitment

Martins

Pereira

Lima

et al. 2023

Adv Funct Materials

View full text Add to dashboard Cite

In recent years, printed electronics reached enormous popularity as a result of their huge potential to offer unique features that are not attainable through traditional fabrication, namely low‐cost production, multifunctionality, stretchability, sustainability, and flexibility. Being expected a galloping increase in the use of printed technologies in the near future, due to the digitalization efforts associated with the Internet of Things and the 4.0 revolution, it is timely and desirable to discuss the joint features, the interrelations, the complementarities, the interdependency, and the most demanding challenges linked to the relation between printed technologies and electronic materials. In this context, this study offers a broad review of the numerous printing technologies used in the processing of electronics, commonly used substrates, the most effective printed electronic materials, and the key post‐printing treatments such as sintering. Disruptive challenges in various printing techniques, (un)expected future research directions of printed electronics, and imminent application trends are also highlighted, following a critical and subjective perspective.

show abstract

“…The coating was performed using vapour deposition polymerization at room temperature. The coating method is described in detail in reference (Kokko et al, 2009c). Prior to coating with parylene C, the samples were treated with a silane coupling agent in order to improve the adhesion between the parylene C and the test sample.…”

Section: The Conformal Coatingmentioning

confidence: 99%

Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating

Kokko

Frisk

Heino

2010

Soldering &Amp; Surface Mount Technology

Self Cite

View full text Add to dashboard Cite

Purpose -The purpose of this paper is to study the effect of conformal coating on the thermal cycling reliability of anisotropically conductive adhesive film (ACF) joined flip chip components on FR-4 and polyimide (PI) substrates. Design/methodology/approach -Test chips were joined using flip chip technology and an anisotropically conductive adhesive. The conformal coating used was parylene C and it was applied using the vapour deposition polymerisation method. The reliability of ACF joined flip chip components on FR-4 and PI substrates was evaluated using 2 40/þ 858C thermal cycling testing. Test lots with and without parylene C coating were studied. Additionally, one test lot with initial moisture inside the coating layer and a PI substrate was subjected to the test. The reliability results were analyzed using Weibull analysis and failure analysis was performed to study the failure mechanisms using cross sectioning and optical and scanning electron microscopy. Findings -The results show a clear difference between the FR-4 and PI substrate materials. PI substrate material proved to be reliable enough to withstand the thermal cycling testing. Two different occurrences of the first failures are seen and analyzed with FR-4 substrates. The conformal coating layer did not seem to impair the reliability. Parylene C coating proved to be a reliable choice to protect, and even improve, the thermal cycling reliability of flip chip devices. Originality/value -Usually, conformal coatings are studied in humidity tests. However, it is also vital to know whether the conformal coatings affect the reliability in thermal cycling and there is a lack of reliability studies in this area. This paper gives reliability data for conformal coating users about the influence of thermal cycling.

show abstract

Influence of medical sterilization on ACA flip chip joints using conformal coating

Cited by 8 publications

References 16 publications

Wireless Battery-free and Fully Implantable Organ Interfaces

Wireless Battery-free and Fully Implantable Organ Interfaces

Advances in Printing and Electronics: From Engagement to Commitment

Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating

Contact Info

Product

Resources

About