On the improvement of the ductile removal ability of brittle KDP crystal via temperature effect

Liu, Qi; Chen, Mingjun; Liao, Zhirong; Feng, Junyuan; Xu, Dongdong; Cheng, Jian

doi:10.1016/j.ceramint.2021.08.214

Cited by 27 publications

(18 citation statements)

References 50 publications

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“…Meanwhile, arc OM in the O 0 (X 0 Y 0 Z 0 ) can be expressed as Equation (7). Through discretizing arc OM to lots of points and calculating their position coordinates in the O(XYZ), the wafer surface shape and TTV will be obtained accurately by…”

Section: The Mathematical Model For Ground Wafer Surface Shapementioning

confidence: 99%

“…For a better chip thermo-mechanical reliability, the wafer needs to be processed to a proper thickness [4]. Except the high surface accuracy and integrity [5][6][7], the process efficiency and thickness uniformity are the main requirements for wafer thinning technology. In the industrial production, ultra-precision grinding technology with the workpiece self-rotation characteristic is commonly employed as a total thickness variation (TTV) controllable thinning process with high efficiency [8].…”

Section: Introductionmentioning

confidence: 99%

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An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process

et al. 2022

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The wafer backside grinding process has been a crucial technology to realize multi-layer stacking and chip performance improvement in the three dimension integrated circuits (3D IC) manufacturing. The total thickness variation (TTV) control is the bottleneck in the advanced process. However, the quantitative analysis theory model and adjustment strategy for TTV control are not currently available. This paper developed a comprehensive simulation model based on the optimized grinding tool configuration, and several typical TTV shapes were obtained. The relationship between the TTV feature components and the spindle posture was established. The linear superposition effect of TTV feature components and a new formation mechanism of TTV shape were revealed. It illustrated that the couple variation between the two TTV feature components could not be eliminated completely. To achieve the desired wafer thickness uniformity through a concise spindle posture adjustment operation, an effective strategy for TTV control was proposed. The experiments on TTV optimization were carried out, through which the developed model and TTV control strategy were verified to play a significant role in wafer thickness uniformity improvement. This work revealed a new insight into the fine control method to the TTV optimization, and provided a guidance for high-end grinding tool and advanced thinning process development.

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Section: The Mathematical Model For Ground Wafer Surface Shapementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process

et al. 2022

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“…Currently, ultraprecision mechanical machining is a powerful technique to fabricate nanostructures. − For instance, tip-based nanomachining is a feasible technique for fabricating nanostructures on materials, such as metals, − semiconductors, − and polymers . Particularly, atomic force microscopy (AFM) tip-based nanoscratching has the merits of high machining precision and processing efficiency due to the direct mechanical machining characteristic.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Chiral Nanostructures through Vibration-Assisted Scratching Combined with Wet Etching for Surface-Enhanced Raman Scattering Substrates

Wang

Yan

Geng

2023

ACS Appl. Nano Mater.

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A fabrication technique is proposed based on tip-based ultrasonic vibration-assisted scratching (UVAS) combined with wet chemical etching. UVAS induced a deeper subsurface damage of the machined nanostructure than the conventional scratching (CS), obtaining a high depth-to-width ratio nanostructure after hydrofluoric acid etching. Furthermore, the tip wear for UVAS was lesser than that for CS owing to the small friction of UVAS. Furthermore, periodic nanograting structures, nanodot arrays, and chiral nanostructures were machined by controlling the UVAS trajectory. Moreover, surface-enhanced Raman scattering (SERS) substrates with nanodot arrays and chiral structures were prepared based on the transferred polydimethylsiloxane (PDMS) model after Au deposition. It was found that a large depth-to-width ratio SERS substrate contributed to a high enhancement of the Raman signal. A maximum enhancement factor of 4.03 × 105 could be obtained on an optimal nanodot array SERS substrate when measuring 10–5 mol/L rhodamine 6G (R6G). The circular dichroism (CD) spectra of the chiral nanostructures were revealed through the finite element method simulation. Moreover, the multipole resonance led to the CD enhancement of the chiral nanostructures. Furthermore, the chiral enantiomers (l- and d-cysteines) were tested with the SERS-active chiral nanostructures, which can be recognized using the chiral SERS substrates directly. Thus, the proposed method showed great potential in chiral applications such as chiral sensing and label-free detection.

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“…The KDP crystals are widely used to fabricate the plasma electrode Pockels cell, polarization rotator, and frequency converters, which are the critical functional optics in the laser-driven inertial confinement fusion facilities, to deliver a high-fluence laser (over 10 J/cm 2 ) to the target chamber. However, the KDP crystals are soft-brittle, easy-cracking, and temperature-sensitive, which make these crystals difficult to process . The single-point diamond turning is the mainstream ultraprecision manufacturing technique in engineering.…”

Section: Introductionmentioning

confidence: 99%

“…However, the KDP crystals are soft-brittle, easycracking, and temperature-sensitive, which make these crystals difficult to process. 2 The single-point diamond turning is the mainstream ultraprecision manufacturing technique in engineering. But surface defects (dots, scratches, cracks, etc.)…”

Section: ■ Introductionmentioning

confidence: 99%

Prediction of Nanoscale Water Meniscus Shape between Deliquescent KDP Crystal Optics and AFM Probe for Water-Dissolution Repairing

Chen,

Zhao,

Cheng

et al. 2023

Langmuir

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On the improvement of the ductile removal ability of brittle KDP crystal via temperature effect

Cited by 27 publications

References 50 publications

An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process

An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process

Fabrication of Chiral Nanostructures through Vibration-Assisted Scratching Combined with Wet Etching for Surface-Enhanced Raman Scattering Substrates

Prediction of Nanoscale Water Meniscus Shape between Deliquescent KDP Crystal Optics and AFM Probe for Water-Dissolution Repairing

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