On the Evaluation of the Number of Conducting Channels in Multiwall Carbon Nanotubes

Forestiere, Carlo; Maffucci, Antonio; Miano, G.

doi:10.1109/tnano.2011.2164263

Cited by 27 publications

(13 citation statements)

References 11 publications

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“…inductance matrix (which includes Lk only in the self terms) becomes diagonally dominant. This dominance depends on M, which in turns is related to the wire diameter and temperature [34][35][36]. In our case, at room temperature we pass from 20 ≈ M (for multiwall CNTs), to 2 ≈ M (for single-wall CNTs).…”

Section: A Electromagnetically Coupled Nano-interconnectsmentioning

confidence: 82%

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Nanoscale Electromagnetic Compatibility: Quantum Coupling and Matching in Nanocircuits

Slepyan¹,

Boag²,

Mordachev³

et al. 2015

IEEE Trans. Electromagn. Compat.

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Abstract-The paper investigates two typical electromagnetic compatibility (EMC) problems, namely, coupling and matching in nanoscale circuits composed of nano-interconnects and quantum devices in entangled state. Nano-interconnects under consideration are implemented by using carbon nanotubes or metallic nanowires, while quantum devices -by semiconductor quantum dots. Equivalent circuits of such nanocircuits contain additional elements arising at nanoscale due to quantum effects. As a result, the notions of coupling and impedance matching are reconsidered. Two examples are studied: in the first one, electromagnetically coupled nanowires are connected to classical lumped devices; in the second one, electromagnetically uncoupled transmission lines are terminated on quantum devices in entangled states. In both circuits the EMC features qualitatively and quantitatively differ from their classical analogs. In the second example, we demonstrate the existence of quantum coupling, due to the entanglement, which exists in spite of the absence of classical electromagnetic coupling. The entanglement also modifies the matching condition introducing a dependence of the optimal value of load impedance on the line length.Index Terms -Electromagnetic compatibility, kinetic inductance, nano-circuits, nano-electromagnetism, quantum devices, quantum entanglement. I. INTRODUCTIONODAY's achievements of nanoelectronics allow utilization and manipulation of small collections of atoms and molecules, such as semiconductor heterostructures, quantum wells, quantum wires and quantum dots [1][2][3] radiation with quantum mechanical low-dimensional systems.One of the crucial aspects of electromagnetism for electronic devices and systems is related to their electromagnetic compatibility, i.e., of their ability to operate successfully, with controlled levels of emissions and with a suitable degree of robustness to unwanted electromagnetic couplings via various mechanisms of interference [12][13][14].However, with the transition of electronics to nanoscale new physical phenomena as well as new materials' properties need to be studied. Quantum effects, such as: discrete energy spectrum of charge carriers, existence of phonons, ballistic transport and tunneling, many-body correlations, interface effects, and so on, manifest themselves jointly with classical electromagnetic interactions [15][16]. As a result, the classical design based on the phenomenological separate analysis of physical properties of electric circuit elements and functional properties of devices and systems becomes invalid with respect to nanoelectronics. These considerations lead to the conclusion that the "classical" EMC, completely based on macroscopic electrodynamics, must be deeply revised starting from the basic concepts and opening the era of "nanoEMC" [17][18][19].For instance, the classical scaling rules used to design integrated circuits (ICs) and to implement EMC solutions are based on the macroscopic behavior of the electrical parameters, such as inductances and capa...

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Section: A Electromagnetically Coupled Nano-interconnectsmentioning

confidence: 82%

“…Note that the number of conducting channels M strongly depends on the chirality, size and temperature [34]- [36].…”

Section: A Modeling Nanoscale Interconnectsmentioning

confidence: 99%

Nanoscale Electromagnetic Compatibility: Quantum Coupling and Matching in Nanocircuits

Slepyan¹,

Boag²,

Mordachev³

et al. 2015

IEEE Trans. Electromagn. Compat.

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“…Here, we are assuming that only metallic shells will be contributing in electron transport. Hence, considering the spin degeneracy, number of conducting channels (M) in each of SWCNT shell is 2/3 as long as temperature is well below the melting point of SWCNT [23]. Since we have statistically averaged the number of conducting channels we can assume that each of the SWCNT shell is contributing with 2/3 channels.…”

Section: Electrical Transport and Geometry 21 Swcnt Bundle As Intercmentioning

confidence: 99%

Characterization of SWCNT Bundle Based VLSI Interconnect with Self-heating Induced Scatterings

Mohsin

Srivastava

2015

Proceedings of the 25th Edition on Great Lakes Symposium on VLSI

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Performance of single walled carbon nanotube (SWCNT) bundle-based VLSI interconnects has been studied under the strong influence of scatterings induced by self-heating. Landauer Büttiker formalism along with Fourier heat transfer equation have been used to compute interconnect scattering parameters at various cross sectional areas of the interconnection. Cross sectional temperature calculation was performed using finite difference method considering temperature dependent thermal conductivity for primitive defect-less SWCNT bundles. Using the relaxation time approximation, we have studied scattering dynamics in calculating equivalent resistance. Electronic and thermal transport equations have been coupled and solved iteratively to get accurate estimation of temperatures and resistances. Study of scattering parameters shows low backscattering however significant transmission loss. Below 100GHz, for a 1µm long interconnect with 10 nm by10 nm cross sectional area shows S 21 as high as 80dB. In terahertz regime transmission parameter S 21 is in the range of few hundreds dB.

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“…In addition, the contribution to the conduction given by the semiconducting shells is not negligible. A rigorous evaluation of M is provided in [24]. An approximated fitting for a MWCNT shell is the following…”

Section: Modeling Carbon Nanotube Interconnectsmentioning

confidence: 99%

“…being a 1 = 3.26 Á 10 À 4 nm À 1 K À 1 , and a 2 = À 0.08 [24]. Therefore, the resistance for MWCNT bundles depend on temperature through the parameters l mfp and M, given by (8) and (9), respectively.…”

Section: Modeling Carbon Nanotube Interconnectsmentioning

confidence: 99%

Temperature effects on electrical performance of carbon‐based nano‐interconnects at chip and package level

Chiariello

Maffucci

Miano

2013

Int J Numerical Modelling

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This paper investigates the electrical performance of innovative carbon-based nano-interconnects made by carbon nanotubes and graphene nanoribbons. The electronic transport in the carbon materials is modeled in the frame of the Transmission Line theory, where the classical per-unit-length circuital parameters are corrected by new terms arising from the quantistic nature of the transport. These parameters are related to the number of the conducting channels and the mean free path, which in turn, are expressed as functions of temperature and size. By coupling this model to the heat equation, a simple electro-thermal model is derived. Case-studies are carried out with reference to 22-nm technology node applications. Copyright ?????? 2013 John Wiley & Sons, Ltd. Copyright ?????? 2013 John Wiley & Sons, Ltd

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On the Evaluation of the Number of Conducting Channels in Multiwall Carbon Nanotubes

Cited by 27 publications

References 11 publications

Nanoscale Electromagnetic Compatibility: Quantum Coupling and Matching in Nanocircuits

Nanoscale Electromagnetic Compatibility: Quantum Coupling and Matching in Nanocircuits

Characterization of SWCNT Bundle Based VLSI Interconnect with Self-heating Induced Scatterings

Temperature effects on electrical performance of carbon‐based nano‐interconnects at chip and package level

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