On-chip phase change heat sinks designed for computational sprinting

Shao, Li; Raghavan, Arun; Emurian, Laurel; Papaefthymiou, Marios C.; Wenisch, Thomas F.; Martin, Milo M. K.; Pipe, Kevin P.

doi:10.1109/semi-therm.2014.6892211

Cited by 27 publications

(24 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Other work in the area proposes using PCM in cooperation with the performance boosting policies to increase system efficiency [4][5][6] [7]. Raghavan et al introduce computa tional sprinting, which is temporarily exceeding the TDP of the chip to improve the responsiveness during short bursts of computation [4].…”

Section: Related Workmentioning

confidence: 99%

“…They also introduce the concept of sprint pacing, where the cores sprint at a lower frequency when half of the thermal capacity is consumed. Other research develops techniques to sprint periodically for longer durations [6] [7]. Safe computational re-sprinting policy targets periodic tasks with hard deadlines and finds the minimum required PCM latent heat capacity to guarantee re-sprinting at full power [6].…”

Section: Related Workmentioning

confidence: 99%

“…On the cooling side, the use of PCMs has been investi gated as a passive cooling technique [4][5] [6] [7]. PCMs are compounds that store large amounts of latent heat during phase change from solid to liquid.…”

Section: Introductionmentioning

confidence: 99%

“…Prior techniques on computational sprinting alternate between sprinting with all cores and not sprinting by switching to idle mode or single core operation [4][5] [6] [7]. However, existing techniques ignore the following observation: due to the inherent heterogeneous heat distribution across a chip, different parts of PCM melt at different rates depending on their location.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Adaptive sprinting: How to get the most out of Phase Change based passive cooling

Kaplan

Coskun

2015

2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)

View full text Add to dashboard Cite

CMOS scaling trends lead to elevated on-chip temperatures, which substantially limit the performance of to day's processors. To improve thermal efficiency, Phase Change Materials (PCMs) have recently been used as passive cooling solutions. PCMs store large amount of heat at near-constant temperature during phase change, allowing strategies such as computational sprinting. While existing sprinting methods al low short performance boosts, there is significant unexplored potential in improving performance on systems with PCM enhanced cooling. To this end, this paper proposes a novel run time management policy driven by observations that are not captured by prior techniques: (i) PCM melts non-uniformly due to spatially heterogeneous on-chip heat distribution; (ii) power consumption during sprinting is highly application dependent and assuming a fixed sprinting power leads to lower thermal efficiency; (iii) if we monitor the remaining PCM energy at various locations, we can utilize the PCM heat storage capability much more efficiently. Theproposed Adaptive Sprinting policy exploits these observations to extend sprinting duration for increased performance gains. Our policy monitors the remaining PCM energy corresponding to each core at run time, and using this information, it decides on the number, the location and the voltage-frequency (V If) setting of the sprinting cores. Experimental evaluation including a detailed phase change thermal model demonstrates 29% performance im provement, 22% energy savings, and 43% energy delay product (EDP) reduction on average, compared to prior strategies.

show abstract

Section: Related Workmentioning

confidence: 99%

Section: Related Workmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Adaptive sprinting: How to get the most out of Phase Change based passive cooling

Kaplan

Coskun

2015

2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)

View full text Add to dashboard Cite

show abstract

“…One example that has attracted a great deal of attention recently suggests the use of PCMs to store excessive heat generated during intense computation from mobile devices (e.g., cellular phones, tablets), which briefly ($1 s) exceeds the maximum steady-state power dissipation by an order of magnitude. Known as computational sprinting [11][12][13][14], this approach aims to improve responsiveness for bursty computational demands in devices restricted by passive cooling.…”

Section: Introductionmentioning

confidence: 99%

Figure-of-merit for phase-change materials used in thermal management

Shao

Raghavan

Kim

et al. 2016

International Journal of Heat and Mass Transfer

Self Cite

View full text Add to dashboard Cite

a b s t r a c tIn this work, we utilize a figure-of-merit (FOM) to compare the performance of various phase-change materials (PCMs) in managing short bursts of high-power heat flux, particularly those associated with microprocessors undergoing bursty operation on a time scale of approximately one second. We numerically investigate the FOM for applications that have realistic boundary conditions and lack analytical solutions. We also fabricate microprocessor proxies with integrated PCM compartments mounted in a smartphone package, and experimentally demonstrate the use of a high-FOM PCM to buffer short heat spikes as large as 11 W/cm 2 .

show abstract

Thermal energy storage for temperature management of electronics

Groulx

2021

Advances in Thermal Energy Storage Systems

View full text Add to dashboard Cite

On-chip phase change heat sinks designed for computational sprinting

Cited by 27 publications

References 16 publications

Adaptive sprinting: How to get the most out of Phase Change based passive cooling

Adaptive sprinting: How to get the most out of Phase Change based passive cooling

Figure-of-merit for phase-change materials used in thermal management

Thermal energy storage for temperature management of electronics

Contact Info

Product

Resources

About