On-Chip Antennas for Inter-Chip Wireless Interconnections: Challenges and Opportunities

Narde, Rounak Singh; Mansoor, Naseef; Ganguly, Amlan; Venkataraman, Jayanti

doi:10.1049/cp.2018.0959

Cited by 21 publications

(14 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Some works appeared in the 2007-2013 period, followed by a significant surge of papers from 2017 to date. Most efforts have been centered in the more mature bands between 20 GHz and 60 GHz [32], [54], [56], [59], [63], [69], [70], [73], with some forays into frequencies over 100 GHz [52], [55], [64], [79].…”

Section: Channel Models For Millimeter Wavesmentioning

confidence: 99%

Wave Propagation and Channel Modeling in Chip-Scale Wireless Communications: A Survey From Millimeter-Wave to Terahertz and Optics

2020

View full text Add to dashboard Cite

The miniaturization of transceivers and antennas is enabling the development of Wireless Networks-on-Chip (WNoC), in which chip-scale communication is utilized to increase the computing performance of multi-core/multi-chip architectures. Although the potential benefits of the WNoC paradigm have been studied in depth, its practicality remains unclear due to the lack of a proper characterization of the wireless channel at the chip scale and across the spectrum, among others. In this paper, the state of the art in wave propagation and channel modeling for chip-scale communication is surveyed. First, the peculiarities of WNoC, including the design drivers, architecture, environment, and on-chip electromagnetics are reviewed. After a brief description of the different methods to characterize wave propagation at chipscales, a comprehensive discussion covering the different works at millimeter-wave (mmWave), Terahertz (THz) and optical frequencies is provided. Finally, the major challenges in the characterization of the WNoC channel and potential solutions to address them are discussed, providing a roadmap for the foundations of practical WNoCs.

show abstract

Section: Channel Models For Millimeter Wavesmentioning

confidence: 99%

Wave Propagation and Channel Modeling in Chip-Scale Wireless Communications: A Survey From Millimeter-Wave to Terahertz and Optics

2020

View full text Add to dashboard Cite

show abstract

“…Although packages can be made of several different materials (e.g., ceramic or plastic), the analysis is here limited to the plastic case for the sake of simplicity. Since the IC sometimes lies on a metal ground acting as heat spreader [21], the bottom layer can be set of plastic or metal as a further option.…”

Section: General Description Of the Multi-core Chip Structurementioning

confidence: 99%

Ray Tracing Modeling of Electromagnetic Propagation for On-Chip Wireless Optical Communications

Fuschini

Barbiroli

Zoli

et al. 2018

JLPEA

View full text Add to dashboard Cite

Multi-core processors are likely to be a point of no return to meet the unending demand for increasing computational power. Nevertheless, the physical interconnection of many cores might currently represent the bottleneck toward kilo-core architectures. Optical wireless networks on-chip are therefore being considered as promising solutions to overcome the technological limits of wired interconnects. In this work, the spatial properties of the on-chip wireless channel are investigated through a ray tracing approach applied to a layered representation of the chip structure, highlighting the relationship between path loss, antenna positions and radiation properties.

show abstract

“…This has been formulated by Matolak et al through micro-reverberation theory [40], yet without detailing the package structure. In fact, very few studies include the chip package in their simulations or measurements and, those that do it, are limited to low frequencies or lack proper justifications on the antenna type and placement [42], [44], [45]. Others simply assume free space over the insulator layer [18], [31]- [34].…”

Section: Introductionmentioning

confidence: 99%

Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication

Timoneda

Abadal

Franques

et al. 2020

IEEE Trans. Commun.

View full text Add to dashboard Cite

Ubiquitous multicore processors nowadays rely on an integrated packet-switched network for cores to exchange and share data. The performance of these intra-chip networks is a key determinant of the processor speed and, at high core counts, becomes an important bottleneck due to scalability issues. To address this, several works propose the use of mm-wave wireless interconnects for intra-chip communication and demonstrate that, thanks to their low-latency broadcast and system-level flexibility, this new paradigm could break the scalability barriers of current multicore architectures. However, these same works assume 10+ Gb/s speeds and efficiencies close to 1 pJ/bit without a proper understanding on the wireless intra-chip channel. This paper first demonstrates that such assumptions are far from realistic by evaluating losses and dispersion in commercial chips. Then, we leverage the system's monolithic nature to engineer the channel, this is, to optimize its frequency response by carefully choosing the chip package dimensions. Finally, we exploit the static nature of the channel to adapt to it, pushing efficiency-speed limits with simple tweaks at the physical layer. Our methods reduce losses by 47 dB and dispersion by 7.3×, enabling intrachip wireless communications over 10 Gb/s and only 1.9 dB away from the dispersion-free case.

show abstract

On-Chip Antennas for Inter-Chip Wireless Interconnections: Challenges and Opportunities

Cited by 21 publications

References 0 publications

Wave Propagation and Channel Modeling in Chip-Scale Wireless Communications: A Survey From Millimeter-Wave to Terahertz and Optics

Wave Propagation and Channel Modeling in Chip-Scale Wireless Communications: A Survey From Millimeter-Wave to Terahertz and Optics

Ray Tracing Modeling of Electromagnetic Propagation for On-Chip Wireless Optical Communications

Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication

Contact Info

Product

Resources

About