Offset reduction in multicollector magnetotransistors

Metz, Matthias; Schneider, Michael L.; Hàberli, A.; Baltes, H.

doi:10.1109/iedm.1996.554040

Cited by 4 publications

(1 citation statement)

References 3 publications

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“…A novel dynamic offset compensation method was proposed recently [18], but an offset calibration at different temperatures is still indispensable for some applications.…”

Section: Decoupled Magnetotransistormentioning

confidence: 99%

Integrated micromachined decoupled CMOS chip on chip

Schneider

Müller²,

Hàberli³

et al.

Proceedings IEEE the Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structu

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A novel technology for the fabrication of thermally, electrically, and mechanically decoupled n-doped silicon microstructures is presented. The n-silicon may contain p-well regions and, therefore, unrestricted CMOS circuitry and transducers. Furthermore, the technology enables the inexpensive fabrication of silicon membranes with different thicknesses without using epi-layer wafers. It is based on a commercially available industrial CMOS multi-well process which is followed by an anisotropic KOH etching step from the wafer backside using an electrochemical etch stop.As an example, a decoupled CMOS magnetic sensor microsystem in a deep n-well was realized. The well is suspended by a dielectric membrane. The thermal isolation of the suspension has a thermal resistance of 4600"CNJ. The microsystem has a thermal time constant of 3.3 ms. The stabilization of the sensor operation temperature reduces drift effects of the sensor signal offsets related to ambient temperature changes by a factor of 5.

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“…A novel dynamic offset compensation method was proposed recently [18], but an offset calibration at different temperatures is still indispensable for some applications.…”

Section: Decoupled Magnetotransistormentioning

confidence: 99%

Integrated micromachined decoupled CMOS chip on chip

Schneider

Müller²,

Hàberli³

et al.

Proceedings IEEE the Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structu

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Offset in CMOS magnetotransistors. II. Reduction

Metz

Baltes

2001

IEEE Trans. Electron Devices

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Contactless angle measurement by CMOS process with on chip interface circuit

Yan

Xianfeng²,

Lai³

1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105)

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Contactless magnetic-sensitive two-&mensional angle detector system can be used in harsh environments when longer operating lifetime and better reliability are required. In a single chip wafer, we have designed and fabricated several kind of detect6r systems to find out the better way with the industrial CMOS process. One kind is based on four Hall devices, the other kind is based on lateral magnetotransistor(LM), and' a new system which take both advantage of two above systems..' Through system test, we have found the favorable features of the above systems.

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Offset reduction in multicollector magnetotransistors

Cited by 4 publications

References 3 publications

Integrated micromachined decoupled CMOS chip on chip

Integrated micromachined decoupled CMOS chip on chip

Offset in CMOS magnetotransistors. II. Reduction

Contactless angle measurement by CMOS process with on chip interface circuit

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