2011
DOI: 10.1021/nl1033107
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Observation of Hole Accumulation in Ge/Si Core/Shell Nanowires Using off-Axis Electron Holography

Abstract: Hole accumulation in Ge/Si core/shell nanowires (NWs) has been observed and quantified using off-axis electron holography and other electron microscopy techniques. The epitaxial [110]-oriented Ge/Si core/shell NWs were grown on Si (111) substrates by chemical vapor deposition through the vapor-liquid-solid growth mechanism. High-angle annular-dark-field scanning transmission electron microscopy images and off-axis electron holograms were obtained from specific NWs. The excess phase shifts measured by electron … Show more

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Cited by 45 publications
(37 citation statements)
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“…This is possibly the main reason for the high-density of the hole gas detected in the Ge core /Si shell NW. [22][23][24][25] 2. Electronic structures (a) Vacancies in the RTP Si/Ge NW.…”
Section: Vacancy Sitementioning
confidence: 99%
See 3 more Smart Citations
“…This is possibly the main reason for the high-density of the hole gas detected in the Ge core /Si shell NW. [22][23][24][25] 2. Electronic structures (a) Vacancies in the RTP Si/Ge NW.…”
Section: Vacancy Sitementioning
confidence: 99%
“…In experiments, a high density of hole carriers are found in the core of the Ge core /Si shell NW. [22][23][24][25] Park et al 28 studied the Si dangling bond on the surface and the Au impurity within the Si shell of the Ge core /Si shell NW to explain why a high density of holes is present in the Ge core /Si shell NW. However, the dangling bonds at the interfaces were not considered.…”
Section: Vacancy Sitementioning
confidence: 99%
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“…The p‐n junction can be created in semiconductor single crystals by doping, thereby introducing impurity levels into the band gap, and forming a depletion region with built‐in potential difference across the junction. Heterojunctions consisting of materials with different band gaps exhibit considerable valence and/or conduction band offsets at the interfaces, which cause electrons or holes to reside in the same material2 (type I band alignment) or become separated in different materials3, 4 (type II band alignment). The strain due to lattice mismatch at the interface can also introduce band‐bending, facilitating higher density of charge localization at the interfaces 5.…”
mentioning
confidence: 99%