Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability

Liu, D.S.; Chao, Yang; Lin, Cheng‐Tung; Shen, G.S.; Liu, H.S.

doi:10.1016/s0026-2714(03)00095-7

Cited by 7 publications

(7 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Temperature-dependent properties should be implemented into the model to conduct the nonlinear analysis. Table I lists curves of the copper film [2] and gold bump [6]. The bonding head in the finite-element model is considered rigid and moves downward to deform the inner lead until the gold bump has compressed by 3 m. In practical production, a sinking value shallower than 1 m cannot constrain the inner lead enough, presenting a potential risk for lead lifting.…”

Section: A Relationship Between Stage Temperature and Bump Hardnessmentioning

confidence: 99%

“…The basic formula of bonding force is given by (2) where is the bonding force for single inner lead, is the uniaxial flow stress of the material, and is the area over which the force is distributed. In a beam lead model, there are additional complicating factors that need to be involved in the derivation consideration.…”

Section: Determination Of the Bonding Forcementioning

confidence: 99%

“…1 shows a schematic diagram of the ILB. Liu et al [2] simulated the TCP ILB process using LS-DYNA3D software. Temperature dependent stress-strain curves for the copper film and inner lead base material were determined through tensile experiments and implemented into a three-dimensional finite-element model to conduct the dynamic bonding analysis.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

An Accommodative Approach Designed for TCP Gold-to-Gold Inner Lead Bonding

Chen

Yoon

et al. 2006

IEEE Trans. Electron. Packag. Manufact.

View full text Add to dashboard Cite

This paper proposes an approach that resolves the tradeoff between bond pad crack, the passivation crack, and lead lift failure modes in gold-to-gold inner lead bonding. The bonding head temperature, stage temperature, and bonding force are addressed as three critical recipes. The proposed scenario determines the bonding head temperature according to the maximum compensation flatness, followed by the corresponding stage temperature and required bonding force in sequence. The relevant gold bump hardness, chip warpage, and flatness variation in the bonding tool were evaluated using the finite-element method. The corresponding bonding force was determined using semianalytical equations with empirical factors. A gate driver IC with 280 I/O pins was adopted to conduct the experimental verification in the engineering pilot run. With the optimal recipes, the obtained results demonstrated success in diminishing these three failure modes. The feasibility of proposed approach was verified experimentally.Index Terms-Gold-to-gold, inner lead bonding.

show abstract

Section: A Relationship Between Stage Temperature and Bump Hardnessmentioning

confidence: 99%

Section: Determination Of the Bonding Forcementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

An Accommodative Approach Designed for TCP Gold-to-Gold Inner Lead Bonding

Chen

Yoon

et al. 2006

IEEE Trans. Electron. Packag. Manufact.

View full text Add to dashboard Cite

show abstract

“…Liu et al [6] simulated the TCP ILB process using LS-DYNA3D software. Prior to performing the finite-element (FE) researches, the stress-strain curves of the copper foil were recorded under different temperature environments and implemented into the FE model.…”

Section: A Design Of the Bonding Forcementioning

confidence: 99%

Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)

Yoon²,

Ahn³

et al. 2005

IEEE Trans. Electron. Packag. Manufact.

View full text Add to dashboard Cite

This paper proposes an optimization methodology for quickly determining a bonding recipe for the inner lead bonding (ILB) of a tape carrier package (TCP). The recipe consists of the bonding force, stage temperature, bonding time, and geometrical forming. The bonding force derivation was based on the essential relationship between the bonding force and sinking value from the referred literature. The remaining three parameter equations were derived using empirical accumulation. The experimental data were collected by conducting eight TCP product trial runs to validate the methodology. In addition, the user-interface software was programmed to be user friendly. The development cycle time can be condensed from the average number of hours to less than one hour, revealing a time saving improvement during practical applications. Good yield rates were obtained as well.Index Terms-Bonding recipe, inner lead bonding (ILB), tape carrier package (TCP).

show abstract

“…In the TABIILB, Jung et al [2] studied the finite volume method to investigate the respective effects of the bonding temperature and the bonding dwell time on the results of the TAB/ILB process. The lead length on the reliability of TAB/ILB interconnections was studied by stress-strain curves for the copper lead under various temperature conditions, and a tool profile variance of less than 1.25 J.lm and a maximum planarity angle of 0.005 0 represented optimal values for minimizing bump deformation [3]. According this section, the real temperature distribution was assumed a constant value.…”

Section: Introductionmentioning

confidence: 99%

Effect of bonding temperature on eutectic interconnections in Chip-On-Film packages

Liu

Yeh

Tsai³

et al. 2008

2008 International Conference on Electronic Materials and Packaging

View full text Add to dashboard Cite

Chip-On-Film (COF) packaging is an attractive solution for the direct attachment of chips onto a polyimide (PI) substrate patterned with copper leads. However, despite its many advantages, the eutectic Au-Sn alloy formed in the high temperature bonding process has a number of unsolved reliability issues. Accordingly, the current study performs a series of experiments to investigate the heat dissipation characteristics of the COF process in order to develop a design tool to predict the optimum eutectic bonding parameters. In the experiments, the temperature is measured at three separate positions on the inner lead bonding (ILB) apparatus using a thermocouple wire. The heat transfer characteristics of the bonding tool surface are also measured using a system comprising a PID controller, a solid state relay and a thermocouple extension wire. An finite element (FE) model is then constructed to simulate the temperature distribution within the COF/ILB system under equivalent temperature conditions. The validity FE model is used to construct a design chart which specifies the temperatures of the bonding tool and chip support stage which ensure that the Au-Sn eutectic temperature is achieved at the bump / inner lead interface. The results indicate that the tool temperature should be no lower than 100°C (with a stage temperature of 312°C) and no higher than 300°C (with a stage temperature of 302°C ).

show abstract

Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability

Cited by 7 publications

References 11 publications

An Accommodative Approach Designed for TCP Gold-to-Gold Inner Lead Bonding

An Accommodative Approach Designed for TCP Gold-to-Gold Inner Lead Bonding

Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB)

Effect of bonding temperature on eutectic interconnections in Chip-On-Film packages

Contact Info

Product

Resources

About