2013
DOI: 10.1002/pip.2399
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Numerical simulations of rear point-contacted solar cells on 2.2 Ωcm p-type c-Si substrates

Abstract: Rear surface of high‐efficiency crystalline silicon solar cells is based on a combination of dielectric passivation and point‐like contacts. In this work, we develop a 3D model for these devices based on 2.2 Ωcm p‐type crystalline silicon substrates. We validate the model by comparison with experimental results allowing us to determine an optimum design for the rear pattern. Additionally, the 3D model results are compared with the ones deduced from a simpler and widely used 1D model. Although the maximum effic… Show more

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Cited by 13 publications
(4 citation statements)
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“…For an optimized design the optimum pitch must evolve with the passivation of the contacts and an accurate model of the device is crucial in this task. For example, in [11] our 3D model is compared to simpler and widely used 1D approach. 1D model tend to overestimate V oc for devices with and leading to lower FF values.…”
Section: Resultsmentioning
confidence: 99%
“…For an optimized design the optimum pitch must evolve with the passivation of the contacts and an accurate model of the device is crucial in this task. For example, in [11] our 3D model is compared to simpler and widely used 1D approach. 1D model tend to overestimate V oc for devices with and leading to lower FF values.…”
Section: Resultsmentioning
confidence: 99%
“…The electro‐optical device simulations adopt up‐to‐date physical and electrical models (including doping and carrier density dependence of mobility, band‐gap narrowing, Auger and trap‐assisted recombination) reported in , and successfully used in relevant simulation studies , . The optical simulation has been performed by means of raytracing accounting for an antireflection coating (ARC) layer consisting of a 105‐nm‐thick silicon dioxide layer.…”
Section: Device Fabrication and Modelingmentioning
confidence: 99%
“…Therefore, there are no inversion or accumulation layers below passivated surfaces; and (x) physical models-for example. carrier statistics, band gap narrowing, and carrier mobilities-are the same as considered in [27]. xi) Ohmic losses related to the backside metallization grid (fingers and busbars) are modeled by a lumped series resistance (R s ) in Ω units whose value is …”
Section: Appendix: Black Silicon Etching Interdigitated Back Contactementioning
confidence: 99%