Numerical prediction of failure paths at a roughened metal/polymer interface

Noijen, Sander; Sluis, O. van der; Timmermans, P.H.M.; Zhang, G.Q.

doi:10.1016/j.microrel.2009.06.019

Cited by 13 publications

(10 citation statements)

References 6 publications

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“…It appears that cavitation is governed by surface roughness of the opposite material (in our case, the copper film) and large hydrostatic tension in the highly constrained adhesive layer. A possible approach to consider the effect of surface roughness on adhesion properties is given in the works of Yao and Qu [33] and Noijen et al [34]. Supplementary to these deterministic approaches, the stochastic nature of the geometry of the roughness profiles, being of major importance on the occurring interface phenomena, could be taken into account by adopting a perturbation method within a stochastic finite element framework, as formulated in [35].…”

Section: Discussionmentioning

confidence: 99%

Stretching-induced interconnect delamination in stretchable electronic circuits

Sluis¹,

Hsu²,

Timmermans³

et al. 2010

J. Phys. D: Appl. Phys.

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Abstract. Stretchable electronics offer increased design freedom of electronic products. Typically, small rigid semiconductor islands are interconnected with thin metal conductor lines on top of, or encapsulated in, a highly compliant substrate, such as a rubber material. A key requirement is large stretchability, i.e. the ability to withstand large deformations during usage without any loss of functionality. Stretching induced delamination is one of the major failure modes that determines the amount of stretchability that can be achieved for a given interconnect design. During peel testing, performed to characterize the interface behaviour, the rubber is severely lifted at the delamination front while at the same time fibrillation of the rubber at the peel front is observed by ESEM analyses. The interface properties are established by combining the results of numerical simulations and peeling experiments at two distinct scales: the global force-displacement curves and local rubber lift geometries. The thus quantified parameters are used to predict the delamination behaviour of zigzag and horseshoe patterned interconnect structures. The accuracy of these finite element simulations is assessed by a comparison of the calculated evolution of the shape of the interconnect structures and the fibrillation areas during stretching with experimental results obtained by detailed in-situ analyses.

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Section: Discussionmentioning

confidence: 99%

Stretching-induced interconnect delamination in stretchable electronic circuits

Sluis¹,

Hsu²,

Timmermans³

et al. 2010

J. Phys. D: Appl. Phys.

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“…Numerical models to describe and predict the failure behavior of bi-material interfaces have been proposed in e.g. [3,9,10,11]. Yao and Qu [3] developed a fracture mechanics model to predict the amount of adhesive and cohesive failure in rough polymer-metal interfaces.…”

Section: Introductionmentioning

confidence: 99%

Microscale simulation of adhesive and cohesive failure in rough interfaces

Hirsch

Kästner

2017

Engineering Fracture Mechanics

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Multi-material lightweight designs, e.g. the combination of aluminum with fiber-reinforced composites, are a key feature for the development of innovative and resource-efficient products. The connection properties of such bimaterial interfaces are influenced by the geometric structure on different length scales. In this article a modeling strategy is presented to study the failure behavior of rough interfaces within a computational homogenization scheme. We study different local phenomena and their effects on the overall interface characteristics, e.g. the surface roughness and different local failure types as cohesive failure of the bulk material and adhesive failure of the local interface. Since there is a large separation in the length scales of the surface roughness, which is in the micrometer range, and conventional structural components, we employ a numerical homogenization approach to extract effective tractionseparation laws to derive effective interface parameters. Adhesive interface failure is modeled by cohesive elements based on a traction-separation law and cohesive failure of the bulk material is described by an elastic-plastic model with progressive damage evolution.

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“…For a non-stoichiometric mixture ($90:10 wt. ratio [43]), Poisson's ratio is reported as 0.345 which is in the range of typical values for various epoxy systems 0.3-0.4 [6,44,45].…”

Section: Elastic Properties Of Bulk Epoxymentioning

confidence: 65%