2010
DOI: 10.1016/j.mee.2009.12.048
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Novel SU-8 based vacuum wafer-level packaging for MEMS devices

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Cited by 28 publications
(23 citation statements)
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“…Figure 4 shows both the measurement results and the cross-sectional SEM image of the bulk device with SU-8 encapsulation. The bulk device switches from HRS to LRS in the range from 2.5 V to 3.5 V; and from LRS to HRS in the range from 4.5 V to 5.5 V. Interestingly, the device On/ Off ratio in Figure 4 is above 10,6 which is even larger than the On/Off ratio measured in vacuum (Figure 1(b)). 11 The resistive switching of bulk SiO 2 devices with SU-8 encapsulation in air ambient demonstrates that reversible switching does not require vacuum conditions or a non-oxidizing ambient.…”
mentioning
confidence: 76%
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“…Figure 4 shows both the measurement results and the cross-sectional SEM image of the bulk device with SU-8 encapsulation. The bulk device switches from HRS to LRS in the range from 2.5 V to 3.5 V; and from LRS to HRS in the range from 4.5 V to 5.5 V. Interestingly, the device On/ Off ratio in Figure 4 is above 10,6 which is even larger than the On/Off ratio measured in vacuum (Figure 1(b)). 11 The resistive switching of bulk SiO 2 devices with SU-8 encapsulation in air ambient demonstrates that reversible switching does not require vacuum conditions or a non-oxidizing ambient.…”
mentioning
confidence: 76%
“…The spun-on SU-8 photoresist meets this requirement and has been used in various circumstances for hermetic sealing purposes. 10 With proper planarization to reduce topography, other common materials (e.g., silicon nitride silicon oxynitride) may serve the same hermetic encapsulation role. 21,22 The SU-8 2002 photoresist ($2 lm thick) was applied to the sample to ensure full coverage of the top surface, followed by prebake at 95 C a)…”
mentioning
confidence: 99%
“…One is a glass plate and the other is a FDTS-coated glass plate via molecular vapor deposition. 52 FDTS stands for Cl 3 Si(CH 2 ) 2 (CF 2 ) 7 CF 3 .…”
Section: Methodsmentioning
confidence: 99%
“…The mechanism of differential pressure is a well known method in microfluidic fluid flow impulsion, where the use of epoxy resins such as SU-8 opens up new possibilities for the implementation of pressure-driven flow on-chip. Although polymers are typically several orders of magnitude more permeable to gas leakages than glass or metals, epoxy resins are characterized by a low gas permeability and thus can be used for simple and low-cost sealing of packages Murillo et al (2010). In addition to this, SU-8 epoxy shows a decrease in gas permeability when the level of crosslinking is increased, being a suitable and interesting alternative for pressurized or vacuum microchambers fabrication Metz et al (2004).…”
Section: Pressure Chambersmentioning
confidence: 99%