2007
DOI: 10.1109/tsm.2006.890315
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Novel Process to Improve Defect Problems for Thermal Nanoimprint Lithography

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Cited by 9 publications
(8 citation statements)
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“…In nano-imprint process, due to the environment, materials, or processes, for example, air bubbles, the mold deformation, uneven coating, unparallel between the substrate and the mold, and so on, will produce a variety of defects [26][27]. How to control and avoid the emergence of various defects in imprint lithography and improve the quality of imprint pattern is therefore key issues.…”
Section: Defectmentioning
confidence: 99%
“…In nano-imprint process, due to the environment, materials, or processes, for example, air bubbles, the mold deformation, uneven coating, unparallel between the substrate and the mold, and so on, will produce a variety of defects [26][27]. How to control and avoid the emergence of various defects in imprint lithography and improve the quality of imprint pattern is therefore key issues.…”
Section: Defectmentioning
confidence: 99%
“…Relatively low density in these regions may suggest that they may possibly be subjected to the occurrence of defects. Particularly, the reentrant corners are found to have low density and this is why incomplete patterns may be found in these regions [34].…”
Section: Adhesion: the Effect Of Self-assembly Monolayermentioning
confidence: 99%
“…This method considers volumn of resist changes according to temperature and pressure. For polymer material, The relation of fractional free volume of resist and imprint temperature and pressure can be assumed as [9] :…”
Section: Temperature-pressure Variation Imprintmentioning
confidence: 99%
“…Several methods have been used to enhance the imprint quality, including air cushion press [7], soft press [8], Temperature-Pressure Variation [9], Electrostatic Force-Assisted [10], and Wafer Bowing [11], among which, Soft press and Temperature-Pressure Variation do not require add other functional part, so the above 2 methods are introduced. …”
Section: Introductionmentioning
confidence: 99%