Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers

Heyen, Johann; Kerssenbrock, T. v.; Chernyakov, A. L.; Heide, P.; Jacob, Arne F.

doi:10.1109/tmtt.2003.819210

Cited by 60 publications

(18 citation statements)

References 6 publications

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“…[1][2][3][4] In addition, LTCC substrates have stable dielectric properties in harsh environments, which is an essential requirement for many automotive and industrial automation applications. 5 However, the thermal fatigue endurance of the second-level solder joints (i.e., the joints between the ceramic module and the organic motherboard) is often diminished because of the high stress level of the joints in test/ field conditions, since the global thermal mismatch between most LTCC tape systems and printed wiring boards (PWBs) is usually more than 10 ppm/°C.…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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The thermal fatigue endurance of two lead-free solder/plastic-core solder ball (PCSB) composite joint structures in low-temperature co-fired ceramic (LTCC) modules was investigated using a thermal cycling test over a temperature range of À55°C to 150°C. The investigated solder alloys were Sn-7In-4.1Ag-0.5Cu (SAC-In) and 95.5Sn-4Ag-0.5Cu (SAC). Three failure mechanisms were observed in the test joints. Transgranular (fatigue) cracking mixed with minor intergranular cracking was the dominant failure mechanism at the outer edge of the joints in both test assemblies, whereas separation of the solder/intermetallic compound (IMC) interface and creep cracking occurred in the other parts of the test joints. The propagation rate of the transgranular crack was lower in the SAC-In joints compared with in the SAC joints. Furthermore, the SAC solder seemed to be more prone to separation of the solder/IMC interface, and more severe intergranular (creep) cracking occurred in it compared with in the SAC-In solder. In the thermal cycling test conditions, the better thermal fatigue endurance of the SAC-In solder composite joints resulted in a 75% higher characteristic lifetime compared with the SAC composite joints.

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Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Nousiainen

Kangasvieri

Rautioaho

et al. 2009

Journal of Elec Materi

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“…In order to meet the demand of satellite technology, microwave components must be miniaturized. Microwave multichip module based on LTCC tridimensional assembly technique is able to achieve the above mentioned requirements [5][6][7]. Three-dimensional(3D) assembly technique can break the limitation of original technology, and convert the assembly technique from XY planar to a 3D stack [8].…”

Section: Introductionmentioning

confidence: 99%

Microwave multichip module tridimensional assembly technology based on LTCC

Zhang¹

2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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With the evolution of microwave substrate, microwave multichip modules are developing towards multilayer. Combined with SMT, high-precision chip assembly, circuit connection, anti-influence partition soldering, module integration technology and so on, those multilayer products constructed by utilizing LTCC technology are attractive candidates to satisfy the demand for telecommunication systems with miniaturized size, intergrated structure and light weight.

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“…A vertical transition that uses the coaxial line structure in order to remove the discontinuity of via-hole has been reported, but only a portion of the vertical transition is a coaxial line structure, while the other region is still a via-hole structure of discontinuity [4]. A vertical transition with three via holes that are similar to a coplanar waveguide (CPW) structure [5] and a vertical transition with five wire lines have also been reported [6].…”

Section: Introductionmentioning

confidence: 99%

High Performance Vertical Transition from DC to 70 GHz for System-on-Package Applications

Yom

Lee

et al. 2008

2008 38th European Microwave Conference

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High performance vertical transition from DC to 70 GHz was proposed for system-on-package (SoP) applications. The trough line, slab line and shielded multilayer coplanar waveguides were employed to minimize the radiation loss, crosstalk and discontinuity of a conventional via vertical transition. The half square via pad was used in order to prevent unwanted coupling between the transmission lines of the vertical transition. The proposed vertical transition was made using a LTCC process. The manufactured single vertical transition showed a low insertion loss less than 0.7 dB and a reflection loss below -13 dB in the frequency range of DC to 70 GHz.

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Novel LTCC/BGA modules for highly integrated millimeter-wave transceivers

Cited by 60 publications

References 6 publications

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

Microwave multichip module tridimensional assembly technology based on LTCC

High Performance Vertical Transition from DC to 70 GHz for System-on-Package Applications

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