2018
DOI: 10.2172/1433077
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Novel Contact Materials for Improved Performance CdTe Solar Cells Final Report

Abstract: This program has explored a number of novel materials for contacts to CdTe solar cells in order to reduce the back contact Schottky barrier to zero and produce an ohmic contact. The project tested a wide range of potential contact materials including TiN, ZrN, CuInSe2:N, a-Si:H and alloys with C, and FeS2. Improved contacts were achieved with FeS2. As part of understanding the operation of the devices and controlling the deposition processes, a number of other important results were obtained. In the process of… Show more

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“…Researchers over the past decades have also investigated alternate back contact materials to ZnTe:Cu, primarily Cu-containing contacts, for example, Cu x Te, Cu x S, Cu/HgTe, CuI, CuSCN, and Cu nanowires with graphene, with a variety of different metallization schemes. Non-Cu-containing contacts have also been explored, for example, Sb 2 Te 3 , As 2 Te 3 , FeS 2 , MoO x , , NiO x , Ni-P, and ZnTe, but results are not definitive and efficiencies are usually lower than Cu-containing counterparts unless the absorber utilizes group V dopants. , None of these materials have yet resulted in a completely loss-free Ohmic hole-transport and electron-reflecting buffer layer, so the formation of a chemically stable barrier-free back contact without recombination remains a great challenge.…”
Section: Introductionmentioning
confidence: 99%
“…Researchers over the past decades have also investigated alternate back contact materials to ZnTe:Cu, primarily Cu-containing contacts, for example, Cu x Te, Cu x S, Cu/HgTe, CuI, CuSCN, and Cu nanowires with graphene, with a variety of different metallization schemes. Non-Cu-containing contacts have also been explored, for example, Sb 2 Te 3 , As 2 Te 3 , FeS 2 , MoO x , , NiO x , Ni-P, and ZnTe, but results are not definitive and efficiencies are usually lower than Cu-containing counterparts unless the absorber utilizes group V dopants. , None of these materials have yet resulted in a completely loss-free Ohmic hole-transport and electron-reflecting buffer layer, so the formation of a chemically stable barrier-free back contact without recombination remains a great challenge.…”
Section: Introductionmentioning
confidence: 99%