Nonlinear multiphoton modification of glass substrates for fabrication of high aspect ratio through-glass vias

Abstract

To meet the demands of high-frequency wireless communications and Internet of Things (IoT) applications, modern integrated circuit (IC) packages should support operating frequencies in the GHz range and be implemented on fine substrate structures. Glass has many advantages as an interposer material for three-dimensional IC (3D-IC) designs, including tunable electrical and mechanical properties, amenability to large-scale processing, and high optical transparency in the visible range. Moreover, glass is easily processed to produce the through-glass vias (TGVs) required to realize high-frequency circuit designs and microelectromechanical systems devices. The present study proposes a method for patterning TGVs on glass substrates via a nonlinear multiphoton-assisted modification process performed using single-pulse irradiation by a 1030-nm picosecond laser. A theoretical model is additionally proposed to describe the glass substrate modification mechanism induced by the nonlinear multiphoton excitation effect. The feasibility of the proposed method is demonstrated by patterning a TGV array with a high aspect ratio of 1:10 and a taper angle of ∼2° on a Corning SGW3 glass substrate.

Direct laser patterning of glass mask for micro display using GHz bursts

“…In this case, MHz regime with relatively low PPB values while maintaining hole depth may be an alternative method 14 . The results presented in current work are initial stages of glass mask fabrication and provide a basis for more reliability evaluations along with the additional wet‐etching processes 15,16 . In addition, any thermal input applied to dielectric material can be controlled by adjusting the burst mode.…”

“…14 The results presented in current work are initial stages of glass mask fabrication and provide a basis for more reliability evaluations along with the additional wet-etching processes. 15,16 In addition, any thermal input applied to dielectric material can be controlled by adjusting the burst mode. It is also necessary to find optimized processes for fabricating the glass mask using the multiple burst technique, which consist of MHz and GHz burst modes.…”

Eco‐friendly glass wet etching for MEMS application: A review

“…Typically, laser power increases and the areas of damaged regions on the glass also increase. It is a very crucial factor in the laser‐modified wet etching process 108 . Another reason is the amount of SiO 2 components.…”

Non-disruptive Bessel-beam array generation for high-throughput shadow mask laser patterning

“…In addition, FGM are easy to clean and wrinkle-free [1]. In order to fabricate through glass channels, glass laser patterning with a Bessel beam followed by laser induced deep etching process (LIDE) has been proposed [1,2]. The laser glass processing with Bessel beams has been proven a fast and reliable instrument for processing of a display glass panels or other glass components.…”