Nondestructive Analysis of Buried Interfacial Behaviors of Flux Residue and Their Impact on Interfacial Mechanical Property

Ulrich, Nathan W.; Andre, John S.; Khanna, K. L.; Wei, Yuying; Xiu, Yonghao; Chen, Zhan

doi:10.1109/tcpmt.2018.2826363

Cited by 8 publications

(15 citation statements)

References 70 publications

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“…The T g of BADGE cured with DDM was found to be between 178 and 189 °C, depending on the curing conditions . The BADGE sample in this study falls within these limits as the curing conditions are similar to that reported in the literature. , …”

Section: Methodssupporting

confidence: 83%

“…For the epoxy/silica interface, no SFG spectra were detected, as we reported previously, 46 showing that there is no ordering of CH groups at the epoxy/silica interface. Both SFG spectra collected from the BADGE/debonding layer interface before and after UV exposure have four peaks.…”

Section: ■ Results and Discussionsupporting

confidence: 58%

“…For comparison purposes, SFG spectra collected from epoxy (without the debonding layer)/silica interfaces before and after UV irradiation as well as SFG spectra collected from the debonding layer before and after UV treatment in the C–H stretching frequency region are also displayed in Figure a. For the epoxy/silica interface, no SFG spectra were detected, as we reported previously, showing that there is no ordering of CH groups at the epoxy/silica interface. Both SFG spectra collected from the BADGE/debonding layer interface before and after UV exposure have four peaks.…”

Section: Resultsmentioning

confidence: 66%

“…70 The BADGE sample in this study falls within these limits as the curing conditions are similar to that reported in the literature. 6,46 Two types of samples were prepared: (1) The debonding layer was prepared on IRFS prisms for SFG spectroscopy measurements and on IRFS windows for XPS analysis. (2) The debonding layer sample was prepared on glass microscope slides for mechanical adhesion testing.…”

Section: Methodsmentioning

confidence: 99%

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Ultraviolet Light-Sensitive Debonding Layer for Reducing Adhesion of Polymer Adhesives for Recycling

et al. 2022

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Separating adhesives from substrates is important for recycling metals and polymer materials used in a variety of applications such as food packaging and electronics. A proof-ofconcept self-assembled debonding layer for debonding adhesives on demand is developed in this research. The debonding layer is applied to a silica surface in three steps. These steps were characterized with sum frequency generation (SFG) vibrational spectroscopy, X-ray photoelectron spectroscopy (XPS), and contact angle goniometry. SFG data shows characteristic signals from each step of the reactions to build the debonding layer. Once the debonding layer is fully prepared, the UV sensitivity was also tested. The results showed that a well-ordered debonding layer can be prepared on a silica surface and the UV-sensitive bond breaks when exposed to UV light. Before debonding the UV-sensitive group on the debonding layer, adhesives could be applied, resulting in an adhesive interface that can be selectively broken. Two adhesive materials, poly(dimethyl siloxane) (PDMS) with a silane adhesion promoter and an epoxy system of diglycidyl ether (BADGE) cross-linked with a diamine compound, were studied and applied to the debonding layer on a silica surface to determine the efficacy of the debonding mechanism. Along with spectroscopic studies, adhesion tests were performed on silica/adhesive and silica/debonding layer/adhesive samples before and after UV irradiation exposure, showing that the debonding by UV light could reduce the adhesion strength. This study lays the groundwork for development of an interfacial debonding layer that reduces adhesion of adhesive polymers from a silica surface as well as other substrates with UV light.

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Section: Methodssupporting

confidence: 83%

Section: ■ Results and Discussionsupporting

confidence: 58%

Section: Resultsmentioning

confidence: 66%

Section: Methodsmentioning

confidence: 99%

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Ultraviolet Light-Sensitive Debonding Layer for Reducing Adhesion of Polymer Adhesives for Recycling

et al. 2022

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“…For 0.7MAA samples with 0.5% added AEAPS, the overall SFG signals from the C–H groups decrease (Figure ). A decrease in the C–H signal, especially methyl C–H signals at interfaces involving polymers, has been shown to be a sign of improved adhesion at polymer/polymer and silica/polymer interfaces. ,− This is believed to arise because methyl groups at an interface cannot generate strong interfacial interactions such as hydrogen bonding, ionic bonding, or covalent bonding. The weak van der Waals interactions of C–H groups at the interface could not lead to strong adhesion.…”

Section: Resultsmentioning

confidence: 99%

Molecular Interactions between Amino Silane Adhesion Promoter and Acrylic Polymer Adhesive at Buried Silica Interfaces

Andre

Grant²,

Greyson³

et al. 2022

Langmuir

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In this study, the influence of an amino silane (3-(2aminoethylamino)-propyldimethoxymethylsilane, AEAPS) on the interfacial structure and adhesion of butyl acrylate/methyl methacrylate copolymers (BAMMAs) to silica was investigated by sum frequency generation vibrational spectroscopy (SFG). Small amounts of methacrylic acid, MAA, were included in the BAMMA polymerizations to assess the impact of carboxylic acid functionality on the glass interface. SFG was used to probe the O− H and CO groups of incorporated MAA, ester CO groups of BAMMA, and CH groups from all species at the silica interfaces. The addition of AEAPS resulted in a significant change in the molecular structure of the polymer at the buried interface with silica due to specific interactions between the BAMMA polymers and silane. SFG results were consistent with the formation of ionic bonds between the primary and secondary amines of the AEAPS tail group and the MAA component of the polymer, as evidenced by the loss of the MAA O−H and CO signals at the interface. It is extensively reported in the literature that methoxy head groups of an amino silane chemically bind to the silanols of glass, leaving the amine groups available to react with various chemical functionalities. Our results are consistent with this scenario and support an adhesion promotion mechanism of amino silane with various aspects: (1) the ionic bond formation between the tail amine group and acid functionality on BAMMA, (2) the chemical coupling between the silane head group and glass, (3) migration of more ester CO groups to the interface with order, and (4) disordering or reduced levels of CH groups at the interface. These results are important for better understanding of the mechanisms and effect of amino silanes on the adhesion between acrylate polymers and glass substrates in a variety of applications.

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Surface Analysis: Sum Frequency Generation Spectroscopy

Ulrich¹,

Andre²,

Chen³

2018

Reference Module in Chemistry, Molecular Sciences and Chemical Engineering

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Nondestructive Analysis of Buried Interfacial Behaviors of Flux Residue and Their Impact on Interfacial Mechanical Property

Cited by 8 publications

References 70 publications

Ultraviolet Light-Sensitive Debonding Layer for Reducing Adhesion of Polymer Adhesives for Recycling

Ultraviolet Light-Sensitive Debonding Layer for Reducing Adhesion of Polymer Adhesives for Recycling

Molecular Interactions between Amino Silane Adhesion Promoter and Acrylic Polymer Adhesive at Buried Silica Interfaces

Surface Analysis: Sum Frequency Generation Spectroscopy

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