Non-uniform micro-channel design for stacked 3D-ICs

Shi, Bing; Srivastava, Ankur; Wang, Peng

doi:10.1145/2024724.2024874

Cited by 38 publications

(39 citation statements)

References 9 publications

(18 reference statements)

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“…Another work by Shi et al [93] proposes a customized non-uniform channel allocation technique, where the density of the etched microchannels reflects the cooling demands of various regions of the MPSoC, as shown in Fig. 3.7.…”

Section: Algorithm 1 Heuristic For Micro-channel Placementmentioning

confidence: 99%

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Sabry

Atienza

2014

FNT in Electronic Design Automation

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Section: Algorithm 1 Heuristic For Micro-channel Placementmentioning

confidence: 99%

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Sabry

Atienza

2014

FNT in Electronic Design Automation

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“…Recently, Qian et al [32] extend their previous work by proposing an energy-efficient microchannel clustering technique where the primary aim is to minimize the pumping energy consumed to achieve a given peak temperature constraint. Shi et al [33] propose a customized channel allocation technique, where the density of the etched microchannels reflects the cooling demands of various regions of the IC. However, the channel allocation technique primarily targets the improvement of energy efficiency instead of the thermal distribution.…”

Section: Design-time Optimization For Liquid-cooled 3-d Mpsocsmentioning

confidence: 99%

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Sabry¹,

Sridhar²,

Meng

et al. 2013

IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

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Abstract-Liquid cooling using interlayer microchannels has appeared as a viable and scalable packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannelbased liquid cooling, however, can substantially increase the onchip thermal gradients, which are undesirable for reliability, performance, and cooling efficiency. In this paper, we present GreenCool, an optimal design methodology for liquid-cooled 3-D MPSoCs. GreenCool simultaneously minimizes the cooling energy for a given system while maintaining thermal gradients and peak temperatures under safe limits. This is accomplished by tuning the heat transfer characteristics of the microchannels using channel width modulation. Channel width modulation is compatible with the current process technologies and incurs minimal additional fabrication costs. Through an extensive set of experiments, we show that channel width modulation is capable of complementing and enhancing the benefits of temperatureaware floorplanning. We also experiment with a 16-core 3-D system with stacked dynamic random-access memory, for which GreenCool improves energy efficiency by up to 53% with respect to no channel modulation.

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“…Shi et al [13] proposed a customized channel allocation technique, where the density of the etched microchannels reflects the cooling demands of various regions of the IC. This work primarily targets the improvement of energy efficiency and not thermal balance.…”

Section: Related Workmentioning

confidence: 99%

Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation

Sabry

Sridhar

Atienza

2012

2012 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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Abstract-While possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1,2]. These cooling-induced thermal gradients can be high enough to create undesirable stress in the ICs, undermining the structural reliability and lifetimes. In this paper, we present a novel design-time solution for the thermal gradient problem in liquid-cooled 3D Multi-Processor System-on-Chip (MPSoC) architectures. The proposed method is based on channel width modulation and provides the designers with an additional dimension in the design-space exploration. We formulate the channel width modulation as an optimal control design problem to minimize the temperature gradients in the 3D IC while meeting the design constraints. The proposed thermal balancing technique uses an analytical model for forced convective heat transfer in microchannels, and has been applied to a two tier 3D-MPSoC. The results show that the proposed approach can reduce thermal gradients by up to 31% when applied to realistic 3D-MPSoC architectures, while maintaining pressure drops in the microchannels well below their safe limits of operation.

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Non-uniform micro-channel design for stacked 3D-ICs

Cited by 38 publications

References 9 publications

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Temperature-Aware Design and Management for 3D Multi-Core Architectures

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation

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