Metrology, Inspection, and Process Control for Microlithography XVIII 2004
DOI: 10.1117/12.536445
|View full text |Cite
|
Sign up to set email alerts
|

New technique to reconstruct effective 3D profile from tilt images of CD-SEM

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2
1

Citation Types

0
15
0

Year Published

2008
2008
2018
2018

Publication Types

Select...
6
1

Relationship

1
6

Authors

Journals

citations
Cited by 15 publications
(15 citation statements)
references
References 3 publications
0
15
0
Order By: Relevance
“…The rounding feature of a line is usually represented quantitatively by the sidewall angle, the footing, and the corner indexes (as shown in Fig. ) in practice (Morokuma et al ., ). These two indexes can be defined based on the first derivative of the measured signal level, that is, the distances between peaks and outer zeroes of the first derivative are calculated as the feature indexes.…”
Section: Resultsmentioning
confidence: 97%
See 1 more Smart Citation
“…The rounding feature of a line is usually represented quantitatively by the sidewall angle, the footing, and the corner indexes (as shown in Fig. ) in practice (Morokuma et al ., ). These two indexes can be defined based on the first derivative of the measured signal level, that is, the distances between peaks and outer zeroes of the first derivative are calculated as the feature indexes.…”
Section: Resultsmentioning
confidence: 97%
“…Tanaka et al . have developed a multiple parameter profile characterization algorithm (Shishido et al ., ; Tanaka et al ., ; Morokuma et al ., ) based on MC simulated and experimental results, which partitions the SEM image signal into the sidewall and footing based on the first deviation of the measured signal level. It applies to top‐down SEM images and no throughput loss will be incurred; it is shown to have a 3‐sigma accuracy of ±0.9 for sidewall angle deviating by more than 2°.…”
Section: Introductionmentioning
confidence: 99%
“…When the line/feature size is decreased to several tens nanometers, the bias due to the edge effect would become more obvious. A lot of works including both experimental study (Bunday et al, 2007;Choi et al, 2006;Jones et al, 2003;Kawada et al, 2003;Maeda et al, 2008;Matsumoto et al, 2006;Morokuma et al, 2004;Novikov et al, 2007;Rice et al, 2006;Shishido et al, 2002;Tanaka et al, 2003;Tanaka et al, 2004;Tanaka et al, 2005;Tanaka et al, 2007;Tanaka et al, 2008a;Tanaka et al, 2008b;Wang et al, 2007;Yamane & Hirano, 2005) and theoretical investigation (Abe et al, 2007;Babin et al, 2008a;Babin et al, 2008b;Bunday & Allgair, 2006;Dersch et al, 2005;Frase et al, 2007a;Frase et al, 2007b;Gorelikov et al, 2005;Villarrubia et al, 2004;Villarrubia et al, 2005a;Villarrubia et al, 2005b) with MC simulation methods have been done, aiming at accurate estimation of the CD values with CD-SEM. However, when the dimension decreases to tens nanometers most of the experiential methods, such as, the maximum derivative method, the regression to baseline method and the sigmoidal fit method, face different difficulties (ITRS, 2007;Villarrubia et al, 2005a).…”
Section: Simulation Of Cd-sem Images For Critical Dimension Nanometromentioning
confidence: 99%
“…A reasonable algorithm is urgently needed for the linewidth metrology of nanometer systems. Several algorithms (Bunday & Allgair, 2006;Frase et al, 2007a;Morokuma et al, 2004;Novikov et al, 2007;Shishido et al, 2002;Tanaka et al, 2003;Villarrubia et al, 2004;Villarrubia et al, 2005a;Villarrubia et al, 2005b) by MC methods for CD linewidth determination have been brought up to meet the limitation of the traditional experiential algorithms.…”
Section: Simulation Of Cd-sem Images For Critical Dimension Nanometromentioning
confidence: 99%
“…3,4 The past two decades have also seen the prodigious rise of scatterometry or optical critical dimension (OCD) metrology for in-line process control. 57 Despite steadily increasing demands on the accuracy of the required models, both SEM and scatterometry continue to be widely utilized for process metrology.…”
Section: Introductionmentioning
confidence: 99%