New polymer materials for nanoimprinting

Abstract

We have investigated new aromatic polymers for nanoimprint and subsequent dry etching, namely thermoset and thermoplastic compounds. They were tested in a SiO 2 patterning process under low pressure and high plasma density conditions and feature a selectivity about twice as high as poly͑methylmethacrylate͒ ͑PMMA͒. The imprint behavior is comparable to PMMA and, in particular, the thermoplastic polymers show excellent imprint quality. This was demonstrated by replication of large arrays of lines down to 50 nm width. The thermoset polymers showed excellent dry etch stability and Teflon-like antisticking layers helped to imprint them without sticking.

Wafer bonding with nano-imprint resists as sacrificial adhesive for fabrication of silicon-on-integrated-circuit (SOIC) wafers in 3D integration of MEMS and ICs

“…Two types of commercially available nano-imprint resists have been evaluated. Both evaluated resists are allyl-based thermosetting (cross-linking) polymers that have a high thermal and chemical stability [12][13][14]. They are compatible with semiconductor processing environments and can be etched in pure oxygen plasmas without leaving any residues at the surfaces.…”

Deformation Mechanism and Punch Taper Effects on Nanoimprint Process by Molecular Dynamics

“…This fundamental difference in principle is to free NIL from many problems suffered in conventional lithography, such as the light diffraction limit, scattering, and the chemistry of photoresist material. 1) The elemental resolution close to 10 nm was constructed, including a nanocompact disk and an optical grating; 2) however, current studies related to NIL were restricted in experiments, for examples, using a high-hardness punch (diamond) to prevent punch wear during the NIL process, 3) an embossing technique on a nonplanner surface, 4) new materials related to photoresists, 5) and laser-assisted direct imprinting in silicon. 6) In order to realize the nanoimprinting deformation mechanism, some analytical methods need to be developed.…”

Mask definition by nanoimprint lithography

“…In spite of its good thermal and mechanical properties for the replication process this polymer has poor dry etch stability and selectivity for most gases used in silicon or silicon dioxide etching [3]. To avoid such inconveniences it is possible to use either specially improved new polymer materials [5] or to test other commercially available polymers that are not generally in use as microelectronic resists. In the latter case amorphous polymers with aromatic constituents are preferable.…”