New mode crack of LSI package in the solder reflow process

Adachi, M.; Ohuchi, Shinji; Totsuka, N.

doi:10.1109/iemt.1991.279771

Cited by 9 publications

(2 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Conventional failure criteria based on bending or shear strength were used to determine the expected location of failure. When moisture within the package is vaporized at the interface between the chip and die pad during the soldering process, the resulting vapour pressure can lead to delamination, and finally, a crack into the EMC if the stress exceeds the bending strength of the EMC (Adachi et al, 1993). Also, Ohizumi et al (1987) assumed that a crack occurs when the maximum principal stress exceeds the flexural strength of the EMC.…”

Section: Temperature and Thermal Stress Analysismentioning

confidence: 99%

Improving the reliability of a plastic IC package in the reflow soldering process by DOE

Kim

Lee

2005

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

Purpose -Optimisation of the package design in order to reduce stresses in a plastic small outline J-lead (SOJ) package and to thereby prevent fractures during the infrared soldering process. Design/methodology/approach -Finite element (FE) modelling was used, both with and without crack tip-modelling. A design of experiment (DOE) approach was used to reduce the number of FE models required. Findings -The optimum design values for minimization of thermal stress and the prevention of fracture were found to be different. The results allow the values of design variables such as the dimensions and material properties of the IC package. Practical implications -To reduce the stresses and thereby prevent fracture, the values of the Young's modulus and coefficient of thermal expansion of the epoxy moulding compound should be reduced. Originality/value -The work has used both stress analysis and fracture mechanics analysis along with DOE to identify the design values which simultaneously reduce the thermal stresses and prevent the fracture of the IC package.

show abstract

Section: Temperature and Thermal Stress Analysismentioning

confidence: 99%

Improving the reliability of a plastic IC package in the reflow soldering process by DOE

Kim

Lee

2005

Soldering &Amp; Surface Mount Technology

View full text Add to dashboard Cite

show abstract

“…and computational modelling schemes to depict moisture absorption behaviour, characterise relevant properties, and predict hygroscopic stresses. Among these research efforts, the study of vapour pressure, which originates from the accumulation of moisture along material interfaces and is responsible for the well‐known popcorn cracking at high temperatures [3–7], presents one of the most challenging technical tasks. Such a study is highly demanded as electronic technologies evolve:…”

Section: Introductionmentioning

confidence: 99%

Vapour Pressure Modelling for Plastic Encapsulated Microelectronics Subjected to Lead‐Free Solder Reflow Profile

Wang

2011

Strain

View full text Add to dashboard Cite

A universal, practical vapour pressure modelling scheme for the plastic encapsulated microelectronics (PEMs) subjected to lead‐free solder reflow profile and other high temperature conditions is presented. The proposed technique employs finite‐element moisture diffusion and structural analysis to calculate the dynamic vapour pressure buildups at the interfacial delaminations in the PEMs. The modelling scheme uses a non‐iterative approach, and it is capable of accurately and efficiently determining the dynamic vapour pressure information required for the reliability‐related design and failure analysis of various kinds of PEMs. The modelling scheme has considerable value to the development of new materials, innovative structures, and effective protection methods for enhancing the performance and reliability of plastic packages.

show abstract

A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks

Lee

Earmme

1996

IEEE Trans. Comp., Packag., Manufact. Technol. A

View full text Add to dashboard Cite

Various package cracks observed in service, with different locations and propagation directions, in plastic packages of surface mount technology (SMT) are analyzed in terms of the energy release rate in fracture mechanics. It has been reported that the types of the cracks observed in the package depend on the chip size, relative thickness of the epoxy resin on the chip and under the chip pad, properties of the materials and the adhesion strength of the interfaces in the package. The stress derived from the thermal expansion mismatch of the materials during the temperature cycling and the pressure induced by the expansion of moisture absorbed in the package at soldering temperature are considered separately in estimating the effects of various parameters on the package cracks. As a result of the analysis, we find that the propagation direction of the package crack is dependent on the location of the delaminated interface from which the package crack originates and the loading type imposed on the package, and that the influence of the various parameters on the package cracks are largely dependent on the loading type. Some results of the analysis are compared with the experimental results.Index Terms-Package cracks, surface mount technology, thermal stress, pressure on the interface, effects of parameters, fracture mechanics, energy release rate.

show abstract

New mode crack of LSI package in the solder reflow process

Cited by 9 publications

References 4 publications

Improving the reliability of a plastic IC package in the reflow soldering process by DOE

Improving the reliability of a plastic IC package in the reflow soldering process by DOE

Vapour Pressure Modelling for Plastic Encapsulated Microelectronics Subjected to Lead‐Free Solder Reflow Profile

A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks

Contact Info

Product

Resources

About