Abstract:Purpose -Optimisation of the package design in order to reduce stresses in a plastic small outline J-lead (SOJ) package and to thereby prevent fractures during the infrared soldering process. Design/methodology/approach -Finite element (FE) modelling was used, both with and without crack tip-modelling. A design of experiment (DOE) approach was used to reduce the number of FE models required. Findings -The optimum design values for minimization of thermal stress and the prevention of fracture were found to be d… Show more
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