2008
DOI: 10.1166/jno.2008.007
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Near-Field Optical Transducer for Heat-Assisted Magnetic Recording for Beyond-10-Tbit/in2 Densities

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Cited by 19 publications
(10 citation statements)
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“…The latter is required in order to assess the feasibility of application of graphene multi-layers for the lateral hot-spot removal and other device-level thermal management applications. 20 Due to the increasing dissipation power density, switching speed and thermal resistance of the multi-layer structures, the device-level thermal management becomes important not only for conventional electronics but also for magnetic memory, 21 logic elements with alternative state variables, 22 three-dimensional and reconfigurable architectures 23 and optoelectronic devices. 24…”
Section: Discussionmentioning
confidence: 99%
“…The latter is required in order to assess the feasibility of application of graphene multi-layers for the lateral hot-spot removal and other device-level thermal management applications. 20 Due to the increasing dissipation power density, switching speed and thermal resistance of the multi-layer structures, the device-level thermal management becomes important not only for conventional electronics but also for magnetic memory, 21 logic elements with alternative state variables, 22 three-dimensional and reconfigurable architectures 23 and optoelectronic devices. 24…”
Section: Discussionmentioning
confidence: 99%
“…The bottom of the stage was illuminated by a xenon lamp (wavelength =150 -2000 nm) with millisecond energy pulses. The temperature of the opposite surface of the sample was monitored with a cryogenically cooled InSb infrared detector [62][63]. The design of the in-plane sample holder ensured that heat traveled ~5 mm inside rGO film along its plane, which is a much larger distance than its thickness, and thus, ensuring the inplane values for thermal diffusivity .…”
Section: Sample Preparation and Annealing Procedurementioning
confidence: 99%
“…13 The thermal-wave travel time allowed us to measure the thermal diffusivity ␣. The thermal conductivity was determined as K = ␣C, where and C are the mass density and specific heat of the material, respectively.…”
Section: Experimental Techniques and Sample Preparationmentioning
confidence: 99%