Nanostructured Si-nanowire microarrays for enhanced-performance bio-analytics

Dawood, M. K.; Zhou, Longfei; Zheng, Han; He, Cheng; Wan, Guoqiang; Rajagopalan, Raj; Too, Heng Phon; Choi, W. K.

doi:10.1039/c2lc40673j

Cited by 18 publications

(21 citation statements)

References 20 publications

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“…Metal‐assisted chemical etching (MacEtch or MaCE) is a robust and versatile process that has been adopted to overcome the limits of conventional semiconductor wet and dry etching technologies . The advantage of producing high aspect ratio micro‐ and nano‐structures with this simple and low‐cost process has attracted attention for improving not only the etch quality but also the performance in many kinds of semiconductor device applications including light emitting diodes, solar cells, biosensors, supercapacitors, and thermoelectrics …”

Section: Introductionmentioning

confidence: 99%

Scaling the Aspect Ratio of Nanoscale Closely Packed Silicon Vias by MacEtch: Kinetics of Carrier Generation and Mass Transport

Kim

Mohseni

Balasundaram

et al. 2017

Adv Funct Materials

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Metal-assisted chemical etching (MacEtch) has shown tremendous success as an anisotropic wet etching method to produce ultrahigh aspect ratio semiconductor nanowire arrays, where a metal mesh pattern serves as the catalyst. However, producing vertical via arrays using MacEtch, which requires a pattern of discrete metal disks as the catalyst, has often been challenging because of the detouring of individual catalyst disks off the vertical path while descending, especially at submicron scales. Here, the realization of ordered, vertical, and high aspect ratio silicon via arrays by MacEtch is reported, with diameters scaled from 900 all the way down to sub-100 nm. Systematic variation of the diameter and pitch of the metal catalyst pattern and the etching solution composition allows the extraction of a physical model that, for the first time, clearly reveals the roles of the two fundamental kinetic mechanisms in MacEtch, carrier generation and mass transport. Ordered submicron diameter silicon via arrays with record aspect ratio are produced, which can directly impact the through-silicon-via technology, high density storage, photonic crystal membrane, and other related applications.

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Section: Introductionmentioning

confidence: 99%

Scaling the Aspect Ratio of Nanoscale Closely Packed Silicon Vias by MacEtch: Kinetics of Carrier Generation and Mass Transport

Kim

Mohseni

Balasundaram

et al. 2017

Adv Funct Materials

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“…Nanowires were vertically standing with height around 10 μm. We have shown previously that such nanowires are porous on the sidewalls [ 2 ]; and due to the high aspect ratio as well as porosity, the substrates to be ideal platform to increase surface loading capacity of biomolecules up to 250 fold [ 1 ]. However, such substrate faces severe problem of wicking.…”

Section: Resultsmentioning

confidence: 99%

“…The fabrication of GLAD-MACE Si nanowires has been reported in our previous study [ 1 , 22 ]. Briefly, Si wafers were subjected to the GLAD deposition of gold.…”

Section: Methodsmentioning

confidence: 99%

“…A major challenge of this technology is to produce reliable and inexpensive substrates that give high signal-to-noise (SNR) detection of analytes. We have recently discovered a unique silicon (Si) nanowire based platform [ 1 ], fabricated by the glancing angle deposition-metal assisted chemical etching (GLAD-MACE) technique that can accommodate an extremely large number of sense-DNA for the addressing of captured analytes. We have attributed the 3-D and unique porous nature of the GLAD-MACE nanowires for the enhanced loading capacity of the platform [ 1 , 2 ].…”

Section: Introductionmentioning

confidence: 99%

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Photo-Attachment of Biomolecules for Miniaturization on Wicking Si-Nanowire Platform

Zheng

et al. 2015

PLoS ONE

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We demonstrated the surface functionalization of a highly three-dimensional, superhydrophilic wicking substrate using light to immobilize functional biomolecules for sensor or microarray applications. We showed here that the three-dimensional substrate was compatible with photo-attachment and the performance of functionalization was greatly improved due to both increased surface capacity and reduced substrate reflectivity. In addition, photo-attachment circumvents the problems induced by wicking effect that was typically encountered on superhydrophilic three-dimensional substrates, thus reducing the difficulty of producing miniaturized sites on such substrate. We have investigated various aspects of photo-attachment process on the nanowire substrate, including the role of different buffers, the effect of wavelength as well as how changing probe structure may affect the functionalization process. We demonstrated that substrate fabrication and functionalization can be achieved with processes compatible with microelectronics processes, hence reducing the cost of array fabrication. Such functionalization method coupled with the high capacity surface makes the substrate an ideal candidate for sensor or microarray for sensitive detection of target analytes.

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“…Among these CMOS compatible biosensing devices, the nanowire biosensing technique is a promising candidate because of its high sensitivity and fast response. 14,15 Because the potential of the nanowire biosensing technique, its design and implementation have been proposed and examined. For instance, Patolsky et al fabricated a single crystal silicon (SCS) NW by chemical vapor deposition (CVD) and examined its good biosensing capabilities.…”

Section: Introductionmentioning

confidence: 99%

A CMOS wireless biomolecular sensing system-on-chip based on polysilicon nanowire technology

Huang

Yen

et al. 2013

Lab Chip

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As developments of modern societies, an on-field and personalized diagnosis has become important for disease prevention and proper treatment. To address this need, in this work, a polysilicon nanowire (poly-Si NW) based biosensor system-on-chip (bio-SSoC) is designed and fabricated by a 0.35 μm 2-Poly-4-Metal (2P4M) complementary metal-oxide-semiconductor (CMOS) process provided by a commercialized semiconductor foundry. Because of the advantages of CMOS system-on-chip (SoC) technologies, the poly-Si NW biosensor is integrated with a chopper differential-difference amplifier (DDA) based analog-front-end (AFE), a successive approximation analog-to-digital converter (SAR ADC), and a microcontroller to have better sensing capabilities than a traditional Si NW discrete measuring system. In addition, an on-off key (OOK) wireless transceiver is also integrated to form a wireless bio-SSoC technology. This is pioneering work to harness the momentum of CMOS integrated technology into emerging bio-diagnosis technologies. This integrated technology is experimentally examined to have a label-free and low-concentration biomolecular detection for both Hepatitis B Virus DNA (10 fM) and cardiac troponin I protein (3.2 pM). Based on this work, the implemented wireless bio-SSoC has demonstrated a good biomolecular sensing characteristic and a potential for low-cost and mobile applications. As a consequence, this developed technology can be a promising candidate for on-field and personalized applications in biomedical diagnosis.

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Nanostructured Si-nanowire microarrays for enhanced-performance bio-analytics

Cited by 18 publications

References 20 publications

Scaling the Aspect Ratio of Nanoscale Closely Packed Silicon Vias by MacEtch: Kinetics of Carrier Generation and Mass Transport

Scaling the Aspect Ratio of Nanoscale Closely Packed Silicon Vias by MacEtch: Kinetics of Carrier Generation and Mass Transport

Photo-Attachment of Biomolecules for Miniaturization on Wicking Si-Nanowire Platform

A CMOS wireless biomolecular sensing system-on-chip based on polysilicon nanowire technology

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