Nanostructure characterization in single and multi layer yttria stabilized zirconia films using XPS, SEM, EDS and AFM

Espitia‐Cabrera, I.; Orozco-Hernández, H.D.; Bartolo‐Pérez, P.; Contreras-Garcı́a, M.E.

doi:10.1016/j.surfcoat.2008.08.051

Cited by 16 publications

(4 citation statements)

References 25 publications

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“…The lower energy peak has also been observed in other transition metals22 and is attributed to absorbed oxygen, while the higher energy peak corresponds to absorbed OH − species. In the Zr 3d peak, the spin-orbit splitting effect is observed, which gives two distinct peaks at 183·7 and 186·1 eV, in agreement with the peaks observed in fully oxidised ZrO 2 23. The Zr 3d doublet is analysed using two Gaussian shaped peaks with full widths at half-maximum of 2·0 eV and a spin-orbit splitting of 2·35 eV.…”

Section: Resultssupporting

confidence: 74%

“…In the Zr 3d peak, the spin-orbit splitting effect is observed, which gives two distinct peaks at 183?7 and 186?1 eV, in agreement with the peaks observed in fully oxidised ZrO 2 . 23 The Zr 3d doublet is analysed using two Gaussian shaped peaks with full widths at halfmaximum of 2?0 eV and a spin-orbit splitting of 2?35 eV. The intensity ratio of the two peaks is 1?26.…”

Section: X-ray Photoelectron Spectroscopymentioning

confidence: 99%

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Development of very thin YSZ films deposited on substrates of varying porosity by e-beam evaporation

Σόμπολος

Yianoulis

2012

Surface Engineering

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We present results of our efforts to develop thin films that may prove to be appropriate solid electrolytes for lower operating temperature solid oxide fuel cells. The electron beam evaporation technique has been used to deposit yttrium stabilised zirconia (YSZ: ZrO 2 stabilised with 8 wt-%Y 2 O 3 ) thin films on a variety of porous and non-porous substrates. Thin films have been grown on conducting films on glass, monocrystalline silicon wafers and highly porous NiO/YSZ substrates. Some of the porous substrates have been polished in order to be able to support thinner films. Films ranging from 0?2 to 2 mm in thickness have been manufactured. Submicrometre thin films have successfully been deposited on NiO/YSZ polished substrates. Operating technical parameters that influence the film properties were studied and the influence of substrate structure and deposition rate has been investigated. The film thickness has been measured in situ via a quartz crystal monitor and ex situ by a stylus profilometer. The morphology of the films has been studied by scanning electron microscopy. Samples have also been investigated in terms of chemical composition via X-ray photoelectron spectroscopy. Using the Scotch tape test, it has been found that the films exhibited good adhesive qualities; however, in some occasions, when annealed, cracks appeared. Using a polished -hence smoothersubstrate has reduced the occurrence of cracks and other abnormalities. The electron gun power -and subsequently the rate of deposition -played an important role in film morphology. The latter presented an interesting crystallite structure in the nanometre range.

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Section: Resultssupporting

confidence: 74%

Section: X-ray Photoelectron Spectroscopymentioning

confidence: 99%

Development of very thin YSZ films deposited on substrates of varying porosity by e-beam evaporation

Σόμπολος

Yianoulis

2012

Surface Engineering

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“…Figure shows the survey XPS spectra of CuSn films taken in a wide range of binding energy. The charge accumulation effect for all spectra was corrected with the binding energy of aliphatic carbon as a reference peak (284.6 eV) . As the RF power on the Cu target decreased, the intensity of Cu 2p decreased and that of Sn 3d increased.…”

Section: Resultsmentioning

confidence: 99%

Surface characterization of CuSn thin films deposited by RF co‐sputtering method

Kang

Park

Kang

2016

Surface & Interface Analysis

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CuSn thin films were deposited by the radio-frequency (RF) magnetron co-sputtering method on Si(100) with Cu and Sn metal targets with various RF powers. The thickness of the films was fixed at 200 ± 10 nm. The synthesized CuSn thin films mainly consisted of Cu 20 Sn 6 and Cu 39 Sn 11 phases, which was revealed by an X-ray diffraction (XRD) study. The high-resolution Cu 2p XPS and Cu LMM Auger electron spectra indicate that metallic Cu oxidized to Cu + and Cu 2+ as the RF power on Cu target increased. The atomic ratios of Sn 0 and Sn 4+ decreased, while that of Sn 2+ increased with increasing RF power on the Cu target. The polar surface free energy (SFE) component has a different tendency in comparison with the total SFE and the dispersive SFE component. The dispersive SFE component was the dominating contributing factor to the total SFE compared with the polar SFE.

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“…43,45,46,48 The characterization of the coating commonly consists of structural analyses of the morphologies (both surficial and cross sectional, yielding such data as surface roughness values and microstructure), grain size, or degree of crystallinity and orientation of the deposited material. To accomplish this, a systematic analysis is needed with the help of X-ray diffractometer (XRD) (for phase analysis, nature of the coating surface crystalline or amorphous, crystalline size 46,47,[49][50][51][52][53][54] ), optical microscopy (OM) (for surface analysis of the coating), scanning electron microscopy (SEM) (for determination of coating thickness and microstructure. To know the nature of deposition of coating such as columnar or laminar and cracks, if any, 55,53 ), energy-dispersive spectroscopy (EDS) (for elemental analysis of the coating and density of the elements of coating material [52][53]55 ), transmission electron microscopy (TEM) (for crystal analysis, selected area electron diffraction (SAED) patterns obtained from TEM provides crystal size and information about single crystal or polycrystalline nature of the coating 51,53,[55][56][57] ), high-resolution transmission electron microscopy (HR-TEM) (for crystallographic plane and orientation of the plane), and atomic force microscopy (AFM) (for surface roughness at atomistic level and the 3D microstructural analysis 53,55,57,58 ).…”

Section: Introductionmentioning

confidence: 99%

Characterization of air plasma based 7YSZ aluminum alloys thermal barrier systems for hot zone

Kumar

Pandey

Das

2016

Proceedings of the Institution of Mechanical Engineers, Part L:

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Characterization of yttria-stabilized zirconia coatings deposited on AA2024-T351 aluminum alloy by air plasma spraying is carried out in the present work to assess its applicability as a thermal barrier coating on automotive components aluminum alloys. Tetragonality of coating microstructures was confirmed through X-ray diffractometer, transmission electron microscopy, and high-resolution transmission electron microscopy. Lattice-image spacing obtained from highresolution transmission electron microscopy confirmed multilayer structure of the coating and that the tetragonal phases are stable. From the optical microscopy it was found that there are good coating particle distribution and homogeneity of coating particles on the substrate while atomic force microscopy provided information about surface bumps and pits. Small roughness of the coating microstructure was found to be very low. Small roughness showed good deposition efficiency of the coating structures.

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Nanostructure characterization in single and multi layer yttria stabilized zirconia films using XPS, SEM, EDS and AFM

Cited by 16 publications

References 25 publications

Development of very thin YSZ films deposited on substrates of varying porosity by e-beam evaporation

Development of very thin YSZ films deposited on substrates of varying porosity by e-beam evaporation

Surface characterization of CuSn thin films deposited by RF co‐sputtering method

Characterization of air plasma based 7YSZ aluminum alloys thermal barrier systems for hot zone

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