Nanomeasurement and fractal analysis of PZT ferroelectric thin films by atomic force microscopy

Jeng, Yeau-Ren; Tsai, Ping-Chi; Fang, Te-Hua

doi:10.1016/s0167-9317(03)00052-2

Cited by 47 publications

(22 citation statements)

References 27 publications

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“…The above analyses indicate that Rq and Ra are strongly affected by the aggregation, structures and the size of the grains. [16,22] This different grain size influences the surface roughness of the films. Rq and Ra can be used to determine the roughness of the surface, but these parameters are rather inadequate to provide a complete description of the irregularity of thin film surfaces.…”

Section: Conventional Processingmentioning

confidence: 99%

Multifractal analysis for Cu/Ti bilayer thin films

Lin

Yang

Wang

et al. 2013

Surface & Interface Analysis

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a Two bilayer thin films with different stacking sequences, Cu/Ti/Si and Ti/Cu/Si, were deposited by DC magnetron sputtering technique. X-ray diffraction technique was used to measure the crystallization structures, and scanning electron microscopy and atomic force microscopy were used to measured surface morphology. The multifractal spectra f(a)-a was used to characterize the surface morphology. The result of |q| max ≤ 53 is obtained by multifractal analysis. The shape of the multifractal spectra f(a) À a is hook-like for Cu/Ti/Si and bell jar-like for Ti/Cu/Si. The spectrum width Δa = a max À a min and Δf(=f(a min ) À f(a max )) of the multifractal spectra is able to quantitatively analyze the growth and surface roughness of the Cu/Ti bilayer thin films. The surface of Ti/Cu/Si thin film is more uniform and smoother than the film of Cu/Ti/Si.

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Section: Conventional Processingmentioning

confidence: 99%

Multifractal analysis for Cu/Ti bilayer thin films

Lin

Yang

Wang

et al. 2013

Surface & Interface Analysis

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“…Both surface roughness and fractal dimension are the important factors in all areas of nano tribology and in evaluating the quality of a nanomachining operation. Yeau-Ren Jeng et al (2003) proposed the radio frequency (RF) magnetron sputtering process is used to generate a lead zirconate titanate (PZT) ferroelectric thin film on a silicon substrate. The surface characteristics of this lead zirconate titanate film are then investigated by means of an atomic force microscopy (AFM) method.…”

Section: Introductionmentioning

confidence: 99%

Fractal dimensional surface analysis of AISI D2 Tool steel material with nanofluids in grinding process using atomic force microscopy

Prabhu¹,

Vinayagam²

2011

J. Braz. Soc. Mech. Sci. & Eng.

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“…The earlier studies have proven that their microstructures are strongly related to their manufacturing process [19,22]. For instance, Chen and colleagues showed that the annealing time and temperature play important roles to obtain rough thin film surfaces [19,23]. In a recent study, Wang et al have confirmed that the film thickness is one of the important parameters to smooth the surface morphology of a thin film [24].…”

Section: Introductionmentioning

confidence: 99%

“…Zahn and Zösch have proven that the applied gas pressure to manufacture thin films can also affects the surface structures of these films [25]. When the importance of the surface morphologies increases as seen in abovementioned studies, several techniques have been developed to obtain the characterization of the thin film surfaces such as microscopic measurements including electron microscopy, atomic force spectroscopy, X-ray diffraction analysis and Auger electron spectroscopy [23,24]. However, those physical techniques can not yield to the entire information on a certain thin film surface without a statistical approach.…”

Section: Introductionmentioning

confidence: 99%

“…However, those physical techniques can not yield to the entire information on a certain thin film surface without a statistical approach. To obtain quantitative results which represent the entire surface of the thin film, above-mentioned techniques are frequently followed by some statistical or mathematical tools such as histogram, profile, power spectra density and fractal dimension [19,23,24,26].…”

Section: Introductionmentioning

confidence: 99%

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Identification of the dynamics of plasma-induced damage in a CuInSe2 thin film by fractal processing

Kurt¹,

Salamov

2006

Cryst. Res. Technol.

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A planar ionization system for rapid visualization and recording the resistance inhomogeneity and photoconductivity distribution in a chalcopyrite-type semiconductor (CuInSe 2 ) copper-indium-diselenide film is studied. A part of the discharge energy is transferred to the electrodes of the system by the bombardment of the electrode surface due to an electron-ion flow. This process leads to the sputtering mechanism of the electrode surface material. It is shown that the plasma-induced damage (PID) in a CuInSe 2 thin film was primarily due to the effectiveness of sputtering and physico-chemical interactions in the discharge gap during the transition from Townsend to the glow type. At the same time a nondestructive method is suggested for the analysis of the dynamics of PID in the CuInSe 2 thin film by fractal processing in the planar ionization system. Some properties of the device have been evaluated, such as a relative change of the resistance inhomogeneity is determined by a relative change of discharge light emission (DLE) intensity when a current is passed through an ionization cell. For the quantitative analysis of the change in the dynamic feature of PID of CuInSe 2 thin films, fractal dimension analysis was used following the records of the DLE intensity. The quality of the film was analyzed using both the profile and spatial distributed DLE intensities data showing the surface inhomogeneity and damage in the thin film as function of time. Thus, by using fractal concept, the order of the surface damage and the quality of the CuInSe 2 as function of time can be assessed exactly and the size and location of the surface inhomogeneities in thin film to be ascertained.

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Nanomeasurement and fractal analysis of PZT ferroelectric thin films by atomic force microscopy

Cited by 47 publications

References 27 publications

Multifractal analysis for Cu/Ti bilayer thin films

Multifractal analysis for Cu/Ti bilayer thin films

Fractal dimensional surface analysis of AISI D2 Tool steel material with nanofluids in grinding process using atomic force microscopy

Identification of the dynamics of plasma-induced damage in a CuInSe2 thin film by fractal processing

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