Nanoindentation load–displacement behavior of pure face centered cubic metal thin films on a hard substrate

A contact area function for Berkovich nanoindentation: Application to hardness determination of a TiHfCN thin film

“…When considering the elastic modulus determination, the indenter displacement must be less than a limiting value, which depends on the mechanical properties of both of the film and of the substrate. This limiting value is close to~1% of the film thickness for a hard film deposited onto a soft substrate [3,4] and it can reach~20% for a soft film deposited onto a hard substrate [5,6].…”

The role of dislocation walls for nanoindentation to shallow depths

“…Guided mostly by experimental evidence in bulk single crystals of Fe-3%Si, W, Cu, Ni, Au (Corcoran et al, 1997;Cordill et al, 2006a;Gerberich et al, 1995) or thin films of Cu and Al (Kramer et al, 1999;Ohmura et al, 2001;Suresh et al, 1999), the schematic loaddepth curves in Fig. 1a and b describe the general observations.…”

“…Upon calculating a large number of dislocation wall spacings for the quasi-static case, a comparison of T/' w b to s l , ignoring s o in Eq. (7), was made using data from the available literature (Bahr et al, 1998;Couret and Caillard, 1985;Greenberg et al, 1992;Ito et al, 1994;Kallingal et al, 1994;Kramer et al, 1999;Nibur et al, 2006;Ohmura et al, 2001;Szcerba and Korbel, 1987). To facilitate this, supplementary indentation data were analyzed for an additional nine metals and alloys (Bahr et al, 1998;Fivel et al, 1998;Frick et al, 2006;Hoehn, 1999;Katz et al, 2001;Kramer et al, 1999;Ohmura et al, 2001;Tymiak, 2001;Yoder et al, 1995).…”

An analysis of the elastic properties of a porous aluminium oxide film by means of indentation techniques

“…(1) corresponds to a composite modulus, which takes into account the influences of both film and substrate. It is acknowledged that for a hard film deposited onto a soft substrate the presence of the latter becomes important as soon as the indenter displacement is higher than 1% of the film thickness [10,11], whereas this critical ratio can be around 20% for a soft film deposited onto a hard substrate [12,13]. For these reasons, application of different models for separating the contributions of the film and substrate is required.…”

“…Sun et al [9] show that this critical ratio is a function of the yield strength ratio and also that it depends on the tip radius. This critical ratio is around 1% for a hard film on soft substrate [10,11] but this value can reach up to 20% for a soft film on hard substrate [12,13]. Consequently, a direct determination can be unachievable for very thin films or in microindentation due to the range of applied loads which are not low enough to only affect the film behaviour.…”