2003
DOI: 10.1116/1.1600446
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Nanofabrication

Abstract: In this the 50th anniversary year of the AVS and the AVS Symposium, this article is offered as one in a series of topical review articles to celebrate the role of this community to the progress in nanofabrication technology. The emphasis of the article is on the principles and limits of the various pattern formation techniques which have emerged as important tools in the research of nanoscale devices and structures. Topics such as e-beam lithography, proximal probes, imprint lithography, self assembly, and dir… Show more

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Cited by 155 publications
(98 citation statements)
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“…Developments in techniques for investigating and manipulating such flow configurations have been driven by recent advances in micro-fabrication techniques allowing the cheap and reliable manufacture of geometries with micron-scale feature resolution (Quake and Scherer, 2000;Ng et al, 2002;Marrian and Tennant, 2003) combined with the trend of miniaturization in the biotechnology, manufacturing and chemical processing industries. Common microfluidic device applications include coating flows, formation of suspensions, emulsions and foams, heat transfer and flows in lab-on-a-chip devices (Obot, 2002;Hansen and Quake, 2003;Stone et al, 2004;Squires and Quake, 2005).…”
Section: P R E P R I N T 1 Introductionmentioning
confidence: 99%
“…Developments in techniques for investigating and manipulating such flow configurations have been driven by recent advances in micro-fabrication techniques allowing the cheap and reliable manufacture of geometries with micron-scale feature resolution (Quake and Scherer, 2000;Ng et al, 2002;Marrian and Tennant, 2003) combined with the trend of miniaturization in the biotechnology, manufacturing and chemical processing industries. Common microfluidic device applications include coating flows, formation of suspensions, emulsions and foams, heat transfer and flows in lab-on-a-chip devices (Obot, 2002;Hansen and Quake, 2003;Stone et al, 2004;Squires and Quake, 2005).…”
Section: P R E P R I N T 1 Introductionmentioning
confidence: 99%
“…Presently, a structure like that in Fig. 1 can be made from metals like gold, nickel, copper, and aluminum with the smallest features with tens of nanometers, and structures like the cavity walls can be made with high aspect-ratios [24,25]. Consequently, the small dimensions of the cavities pose no problem if they are kept above a few tens of nanometers.…”
Section: Casimir Energy and Forcesmentioning
confidence: 99%
“…Presently, by means of electron beam lithography a precision in the level of 1.3 nm has been obtained for the fabrication of MEMS and NEMS [28]. However, most usual techniques are not that accurate and a precision at the level of 10 nm is most likely to be found in an experiment [24]. As a first approximation the ACF could also receive the same correction expressed in Eq.…”
Section: Conductivity Roughness and Temperature Correctionsmentioning
confidence: 99%
“…According to Liddle et al [234], cost-effective nanomanufacturing requires metrology that costs proportionally less than products produced per square meter. In the analysis by Liddle et al areal throughput is related to feature size through Tennant's Law [235], T = αL 5 , where T is areal throughput in μm 2 /h, L is feature length scale in nm, and α is the scaling factor that holds approximately over a wide range of nanomanufacturing technologies. Aside from ES, the smallest feature size produced has been achieved by scanning tunneling lithography (STL), which affords extremely low areal throughput.…”
Section: Fabrication Of Organic Micro-and Nanofiber Semiconductor Symentioning
confidence: 99%