Nanocomposite Ni–TiN coatings prepared by ultrasonic electrodeposition

Xia, Feng; Wu, Meng; Wang, Fan; Zhang, Jia; Wang, Ai-leng

doi:10.1016/j.cap.2007.11.014

Cited by 90 publications

(24 citation statements)

References 12 publications

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“…The results suggest that the oxidative severity of 850-TiN coating gradually deepened with the oxidation temperature increasing. Moreover, the average grain diameters of formed rutileTiO 2 can be calculated using the Scherrer equation [25,26], and they are 216 nm, 237 nm, 288 nm and 373 nm for the (110) planes (the reflections at 2θ angles of 27.61) of rutile-TiO 2 from 600 1C to 750 1C, respectively. This result fits well with the growth rate as the oxidation temperature increasing.…”

Section: Resultsmentioning

confidence: 99%

Oxidation behavior of CVD star-shaped TiN coating in ambient air

Tang

Wang

Zhu

et al. 2015

Ceramics International

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Section: Resultsmentioning

confidence: 99%

Oxidation behavior of CVD star-shaped TiN coating in ambient air

Tang

Wang

Zhu

et al. 2015

Ceramics International

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“…2(b)) [19]. Many studies [20][21][22] focused on the ultrasonic-assisted electrodeposition showed that the main effect of ultrasonic vibrations on plating was to increase the number of nucleus and nucleation rates of the grains. The influence of ultrasonic agitation on the electroforming process should involve two aspects.…”

Section: Microstructure and Morphological Analysismentioning

confidence: 99%

Mechanical properties of electroformed copper layers with gradient microstructure

Liu

Zhou

Liu

et al. 2010

Int J Miner Metall Mater

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The electroformed copper layer with gradient microstructure was prepared using the ultrasonic technique. The microstructure of the electroformed copper layer was observed by using an optical microscope (OM) and a scanning electron microscope (SEM). The preferred orientations of the layer were characterized by X-ray diffraction (XRD). The mechanical properties were evaluated with a Vicker's hardness tester and a tensile tester. It is found the gradient microstructure consists of two main parts: the outer part (faraway substrate) with columnar crystals and the inner part (nearby substrate) with equiaxed grains. The Cu-(220) preferred orientation increases with the increasing thickness of the copper layer. The test results show that the microhardness of the electroformed copper layer decreases with increasing grain size along the growth direction and presents a gradient distribution. The tensile strength of the outer part of the electroformed copper layer is higher than that of the inner part but at the cost of ductility. Meanwhile, the integral mechanical properties of the electroformed copper with gradient microstructure are significantly improved in comparison with the pure copper deposit.

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“…These coatings can contain hard particles such as WC, Al 2 O 3 and ZrO 2 in a deposited matrix such as titania or titanium carbide. Recently, production of reinforcing hard powders with decreasing sizes has found industrial interest to fabricate new composites with better properties by applying of micro-and especially nanoparticles [5][6][7]. The term ''size effect'' for nanoparticles can describe the leading role of these nanocomposites [8].…”

Section: Introductionmentioning

confidence: 99%