Laser and Ion Beam Modification of Materials 1994
DOI: 10.1016/b978-0-444-81994-9.50085-3
|View full text |Cite
|
Sign up to set email alerts
|

Multiple-species implantation for defect engineering of shallow p±junctions in Si(100)

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2005
2005
2005
2005

Publication Types

Select...
1
1

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 4 publications
0
1
0
Order By: Relevance
“…[12][13][14] The combination of anodic etching of thin silicon layers with a surface characterization method such as PAD is an effective tool to measure residual damage accumulation profiles formed into silicon substrate layers which are implanted. 15 Principle of the PAD technique.-The PAD exploits the minute vertical displacement of the silicon surface due to local heating of lower thermal conductivity by the formation of damage by a pulsed laser beam. 14,16 When a laser beam irradiates the damage layer in the silicon substrate surface induced by ion implantation, this dam-age layer in the silicon substrate is heated by recombination of electrical carriers created by photon absorption.…”
Section: Damage Depth Profiles By the Pad Techniquementioning
confidence: 99%
“…[12][13][14] The combination of anodic etching of thin silicon layers with a surface characterization method such as PAD is an effective tool to measure residual damage accumulation profiles formed into silicon substrate layers which are implanted. 15 Principle of the PAD technique.-The PAD exploits the minute vertical displacement of the silicon surface due to local heating of lower thermal conductivity by the formation of damage by a pulsed laser beam. 14,16 When a laser beam irradiates the damage layer in the silicon substrate surface induced by ion implantation, this dam-age layer in the silicon substrate is heated by recombination of electrical carriers created by photon absorption.…”
Section: Damage Depth Profiles By the Pad Techniquementioning
confidence: 99%