Multilayer RF PCB for space applications: technological and interconnections trade-off

Paillard, M.; Bodereau, Frantz; Drevon, C.; Monfraix, P.; Cazaux, Jean-Louis; Bodin, Laurent; Guyon, P. M.

doi:10.1109/eumc.2005.1610270

Cited by 8 publications

(3 citation statements)

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“…There are, however, numerous mm-wave transceiver applications where waveguide system integration is not feasible due to size, weight or cost constraints [40] and if mm-wave transceivers are to be rolled out in large quantities, they need to be integrated in a compact fashion and produced at low cost without sacrificing performance [41]. This dominance of waveguide packaging contrasts with microwave systems [42][43][44] where board level integration is commonplace for a wide variety of systems.…”

Section: Approachesmentioning

confidence: 99%

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Stander

2015

Africon 2015

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Abstract-With an ever increasing number of broadband applications in sub-Saharan Africa, mm-wave point-to-point networking has the potential to fill a niche in communications network architectures. Widespread adoption of this technology would benefit from conventional RF soft substrate integration and packaging, as opposed to system-on-chip or thick film processes. A review on the state-of-the-art in E-band soft substrate systems reveals significant reliance on MMICs. We propose that hybrid integration of active devices with off-chip passives, as well as better integration of active components in SIW, will lead to better performing E-band systems in soft substrates. Specific enabling techniques from the microwave domain are identified.

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Section: Approachesmentioning

confidence: 99%

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Stander

2015

Africon 2015

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“…In general, higher SEY can enhance the possibility of electron multiplication, thereby limiting the power threshold of microwave components [5][6][7][8]. Therefore, SEY reduction on the surface of the functional materials has increasingly become a research focus in satellite HPM components, particularly for dielectric materials that are utilized in multipactor-sensitive components [2,[9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Secondary roughness effect of surface microstructures on secondary electron emission and multipactor threshold for PTFE-filled and PI-filled single ridge waveguides

Meng,

Xu,

Lian

et al. 2024

J. Phys. D: Appl. Phys.

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Secondary electron yield (SEY) is a dominant factor in determining the multipactor threshold. In this study, we analyzed the secondary roughness effect of surface microstructures for plastic dielectric on SEY reduction and multipactor mitigation. A single ridge waveguide (SRW) operating in Ku-band, filled with PTFE or PI, was designed with a dielectric-metal multipactor gap. By employing a femtosecond laser, periodic microstructures were fabricated on PTFE and PI surfaces to suppress SEY. The SEY peak values of PTFE and PI decreased from 2.05 to 1.40 and 1.37 to 1.07 by the porous surface. The surface morphologies and cross-sectional images of the porous PTFE and PI demonstrated the existence of secondary roughness structures. Via simulation, we obtained multipactor thresholds of 8496 W, 12374 W, and 9397 W for the SRWs filled with untreated PTFE surface, ideal porous surface (without secondary roughness), and real porous surface (with secondary roughness). Similar works were implemented for the PI-filled SRWs, resulting in simulated multipactor thresholds of 7640 W, 11327 W, and 9433 W. The results indicate that the multipactor effect may not be effectively suppressed under the influence of secondary roughness structures such as plastic velvet and foam. Besides, simulation works indicated that the radio frequency electric field could extract secondary electrons from the microstructures, weakening the mitigation effect of microstructures on multipactor. The impact of surface charging on electron motion was also analyzed by considering energy distribution. It was suggested that the surface microstructures of plastic dielectrics lead to a decrease in the surface charge density and the electrostatic field strength, weakening the self-extinguishing effect and lowering the multipactor threshold. This study provides an in-depth analysis of the effect of secondary roughness on SEY and multipactor for organic dielectrics, which makes significant sense for the further investigation of dielectric multipactor.

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“…Teflon® (PTFE) [1]. Conventional planar antennas are another example of the practical use of Teflon®-based substrates, like Rogers RT5870®, which is able to withstand the environmental conditions of outer space.…”

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confidence: 99%

Multipactor Effect Characterization of Dielectric Materials for Space Applications

Vague

Melgarejo

Guglielmi

et al. 2018

IEEE Trans. Microwave Theory Techn.

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The objective of this work is to advance the stateof-the-art in the characterization of the multipactor effect in dielectric materials. The materials studied are the most commonly used dielectrics in space applications, namely, Alumina, Rexolite, Rogers RT5870, Rohacell, Teflon and Ultem 1000. In this context, a new family of coaxial waveguide components, covering the Land S-bands, with a wideband, lowpass response has been designed, and six different prototypes have been specifically optimized and manufactured. The six prototypes have then been used to simulate and measure the multipactor breakdown susceptibility charts for the six dielectric materials investigated. Finally, the simulation results are compared with the results of the measurement campaign indicating good agreement.

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Multilayer RF PCB for space applications: technological and interconnections trade-off

Cited by 8 publications

References 0 publications

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

A review of key development areas in low-cost packaging and integration of future E-band mm-wave transceivers

Secondary roughness effect of surface microstructures on secondary electron emission and multipactor threshold for PTFE-filled and PI-filled single ridge waveguides

Multipactor Effect Characterization of Dielectric Materials for Space Applications

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