Multilayer Construction with Various Ceramic Films for Electronic Devices Fabricated by Aerosol Deposition

Abstract

Aerosol deposition (AD) is applicable as a fabrication technology for microstructures comprising different materials. We used this method for electronic devices that consist of ceramic films and metal electrodes. Various ceramic thick films (5–50 μm thickness), for example, Al2O3, 2MgO·SiO2, and BaTiO3, were deposited on substrates using room‐temperature aerosol deposition. The dielectric constant of BaTiO3 was 78 at 1 MHz. Multilayer constructions with ceramic films and copper electrodes were obtained using aerosol deposition and sputtering. During deposition, photoresist film masks were applied to produce patterns of ceramic films and connections between upper and lower electrodes through the ceramic films.

Fabrication of BaTiO3-PTFE composite film for embedded capacitor employing aerosol deposition

“…5(a). These values agreed well with those previously reported [5,6]. The equivalent values for the BaTiO 3 -PTFE composite films were 15 and 0.091, respectively, as shown in Fig.…”

“…However, the relative permittivity of BaTiO 3 films aerosol-deposited at room temperature was sharply reduced to approximately 100 from the general range of 1000-3000 that is typical for BaTiO 3 powder. This abrupt decrease in their relative permitivity was attributed to the collision impact of particles in the AD process [5,6]. During the AD process, accelerated ceramic particles are ejected through a nozzle and then impacted at a velocity of 200-300 m/s onto a substrate to form nano-sized BaTiO 3 films.…”

What Happens during Thermal Post‐Treatment of Powder Aerosol Deposited Functional Ceramic Films? Explanations Based on an Experiment‐Enhanced Literature Survey

“…Much research on PAD films was conducted on piezoelectric lead zirconate titanate (Pb(Zr x Ti 1−x )O 3 , PZT) [49,[78][79][80][81][82][83][84] and dielectric barium titanate (BaTiO 3 ). [85][86][87][88][89] Here, films in the untreated, as-deposited state exhibited a significantly lowered permittivity [90] and in case of piezo ceramics, also a lowered remanent polarization (P r ) [91,92] and coercive field strength (E c ). [24] Thermal post-treatment (annealing) at temperatures between 400 and 1000 °C largely increases the permittivity of PAD films.…”

Elaboration of lead-free Na 0.5 Bi 0.5 TiO 3 –BaTiO 3 (NBT-BT) thick films by aerosol deposition method (ADM)

“…Concerning lead-free materials, only a few papers reported results on the elaboration of thick films by ADM. BaTiO 3 films were successfully obtained on Cu and stainless steel substrates [14,32]. The influence of thickness on dielectric properties was studied and a critical thickness was evidenced (around 1 mm), below which high leakage currents and low resistivity were observed because of the inhomogeneity of the interface between the film and the substrate [33], but ferroelectric properties were not reported.…”