“…In contrast to cold spraying, the AD process is based on deposition in vacuum conditions, significantly enhancing the applicability of ceramic starting powders 11,17,18 . In terms of polar dielectric ceramics, the AD method has been successfully employed to fabricate ferroelectric thick films, for example, lead‐free BaTiO 3 (BT), 2 (K 0.5 Na 0.5 )NbO 3 (KNN), 19,20 and 0.94Na 0.5 Bi 0.5 TiO 3 –0.06BaTiO 3 (NBT–6BT), 21 as well as lead‐based Pb(Zr,Ti)O 3 (PZT) 22,23 and Pb(Mg 1/3 Nb 2/3 )O 3 –PbTiO 3 (PMN–PT) 24 on different substrates, such as ceramic, glass, and metal. Compared to bulk ceramics, dielectric permittivity and resistivity are significantly reduced in as‐processed AD films.…”