Multichip module technologies for high-speed ATM switching systems

Abstract

High-performance, compact multichip modules (MCMs) using a copper polyimide multi-layer substrate are used to make a 40-Gb/s-throughput ATM switching module. The MCM substrate has 392 high-speed signal YO channels, thin-film termination resistors, and 50 pm laminated capacitance layers. We made a subswitching element module using these MCMs, new high-speed FPC cables, and heat pipes fins. This sub-switching element module can operate at 80 Gb/s throughput.

Very compact scalable 80 Gbit/s ATM switching module

“…11 shows an example of the output waveforms. This module uses a high-density flexible printed circuit (FPC) cables/connectors [28] and can be connected to other switching modules to expand the switching system.…”