“…To solve the above-mentioned problems, many researchers have studied several methods, such as the use of superlattices for strain control, a low-temperature AlN seed layer, an InAlN buffer layer for decreasing the lattice mismatch, or a SiN x interlayer between AlN and GaN, and GaN growth on a SiC buffer layer on a Si substrate. 4,[7][8][9][10][11] Among these methods, we focused on the use of a 3C-SiC buffer layer. [12][13][14] Using a stable intermediate layer on a Si substrate, we can prevent a melt back reaction and formed a SiN x layer through a stable interface and low lattice mismatch (3%), which is much smaller than that of the Si substrate (17%).…”