Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint

“…The Cu 3 Sn grain boundary line (Zhao et al , 2017; Zhang, et al , 2013) in the middle of the solder joint was formed when the Cu 3 Sn grains from opposite sides were contacted, as presented in Figure 1(c). Furthermore, from the {100} pole figure (PF) and TD inverse pole figure (IPF) of Cu 3 Sn [Figures 1(d) and 1(e)], Cu 3 Sn grains exhibited preferred orientations of [203] and [100] directions being parallel to TD (perpendicular to the Cu substrate), which was consistent with the previous study (Yang et al , 2022). Figure 3 shows the EBSD results of the cross-section of the solder joints during the conversion of the full Cu 3 Sn solder joint to the full Cu 41 Sn 11 solder joint.…”

Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding

“…At present, given the challenges in the packaging and interconnection of electronic devices, a wide range of materials and processes are considered to address the challenges to enable future high-performance and reliable electronic products [1,2]. It is even more stringent for high-temperature applications under harsh and extreme conditions, particularly in the automotive, aerospace, and energy production sectors with recently significantly increased demands [3]. As far as the mainstream of microelectronic fabrication is concerned, the advancement in 3D integration and advanced packaging is highly imperative with the bolstered input/output density beyond the post-Moore's time driven primarily by everlasting demands for miniaturization [4].…”

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading

“…Cu/Sn micro-solder joints were widely used as the interconnection system in 3D packaging, and the intermetallic compounds (IMCs) generated at the Cu/Sn interface usually consisted of a Cu 6 Sn 5 layer and a Cu 3 Sn layer with Kirkendall voids [4][5][6]. However, the higher service temperature exacerbated the phase transition from Cu 6 Sn 5 to Cu 3 Sn within the micro-solder joints, resulting in the development of a porous Cu 3 Sn layer [7][8][9][10]. These defects significantly impaired the electrical interconnection, signal transmission, and mechanical properties of the micro-solder joints.…”