Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding

Liu, Changqing; Chen, Yi; Jiang, Han; Zhou, Zhaoxia

doi:10.2139/ssrn.4635781

2023

DOI: 10.2139/ssrn.4635781

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Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding

Changqing Liu,

Yi Chen,

Han Jiang

et al.

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Interfacial Intermetallic Compounds Growth Kinetics and Mechanical Characteristics of Ga-Cu Interconnects Prepared Via Transient Liquid Phase Bonding

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