Abstract:Purpose
This study aims to analyse the changes in the microstructure and grain orientation of the full Cu3Sn solder joint (Cu/Cu3Sn/Cu) during isothermal aging at 420°C.
Design/methodology/approach
The Cu3Sn solder joint was fabricated through soldering Cu/Sn/Cu structure and then aged at 420°C. The microstructure evolution and grain orientation were studied by observing the cross-section and top-view surfaces of solder joints.
Findings
Original Cu3Sn solder joint initially transformed into the full Cu41Sn… Show more
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