Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)

Yoon, Jun‐Bo; Han, Chul–Hi; Yoon, Euisik; Kim, Choong‐Ki

doi:10.1109/memsys.1999.746900

Cited by 12 publications

(5 citation statements)

References 15 publications

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“…The final processing steps demonstrated that interlayer adhesion is crucial to hold the three-dimensional structure together. Methods for improving the adhesion include the adoption of processing techniques that use fewer multilayer electroplating interfaces, and permit the simultaneous electroforming of multiple layers; refer to [13,14] for examples of such techniques.…”

Section: Discussionmentioning

confidence: 99%

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Fabrication of three-dimensional inductor coil using excimer laser micromachining

Jolic

Ghantasala

Hayes

et al. 2003

J. Micromech. Microeng.

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Conventional lithographic techniques are typically used for the fabrication of three-dimensional multilayer structures such as micro-inductors and microactuators. In this work a novel approach based exclusively on laser micromachining of dry film resists and electroplating is presented. The process involves seed layer deposition, lamination of dry film resist, laser micromachining and electroplating to mould the resist patterns. The process is then repeated, using intermediate plating seed layers if necessary, to realize the three-dimensional coil structure. The steps for sacrificial material removal involve laser patterning and chemical removal of resist and plating seed layers. The major advantages with this process are that it has fewer steps compared to conventional UV-based processing technology, and it utilizes the benefits of dry film resist processing using the laser. A three-layer micro-inductor coil was designed and fabricated using the new laser micromachining-based processing technology. The problems encountered during fabrication and possible actions to address them are discussed. This work reports the first multilayer structure that has been fabricated exclusively using laser ablation for the patterning of resist. Furthermore, this work reports the first structural layer that has been fabricated using laser ablation of resist to expose an underlying intermediate plating seed layer.

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Section: Discussionmentioning

confidence: 99%

“…Another reported technique makes use of metal moulds rather than photoresist as the sacrificial material [14]. The metal mould also serves as a seed layer for electroplating the next layer of the structure.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of three-dimensional inductor coil using excimer laser micromachining

Jolic

Ghantasala

Hayes

et al. 2003

J. Micromech. Microeng.

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“…The main objective of the work described here is therefore to determine how to achieve the quality fabrication of 3-D micro-structures, enabling their future high-volume reproduction. It has been seen that most previous researchers have tried to obtain a single layer with a high aspect ratio [11][12][13][14]; however, in this work a more conventional high width-to-thickness ratio is employed. This paper therefore presents a novel technique to improve the fabrication process by using many masks to deposit multiple thin layers.…”

Section: Introductionmentioning

confidence: 99%

New Method to Fabrication 3D Micro-Device Structures

Emhemmed

Kriama

Terfaas

et al. 2014

AMM

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“…Further, another technique has been developed that uses metal moulds rather than photo-resist as the sacrificial material [13]. The metal mould also serves as a seed layer for electroplating the next layer of the structure.…”

Section: Introductionmentioning

confidence: 99%

Nano/microfabrication of three-dimensional device structures using a multilayered mould approach

Kriama

Green

Dobson

et al. 2011

Proceedings of the Institution of Mechanical Engineers, Part B:

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There is growing interest in the development of fabrication techniques to cost effectively mass-produced high-resolution (micro/nano) three-dimensional structures in a range of materials. Biomedical applications are particularly significant. This work demonstrates how to fabricate simultaneously a sacrificial mould having the inverse shape of the desired device structure and also create the desired device structure using electrodeposition techniques. The mould is constructed of many thin layers using a photo-resist material that is dissolvable and sensitive to ultraviolet (UV) light. At the same time the device is created in the emerging mould layers using gold electrodeposition technique. Choosing to fabricate the mould and the three-dimensional structures in multiple thin layers allows for the use of UV light and permits the potential cost-effective realization of three-dimensional curved surfaces, the accuracy and geometric details of which are related to the number of layers used. An example is provided to explain the novel fabrication process and to outline the resulting design and fabrication constraints.

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Monolithic integration of 3-D electroplated microstructures with unlimited number of levels using planarization with a sacrificial metallic mold (PSMM)

Cited by 12 publications

References 15 publications

Fabrication of three-dimensional inductor coil using excimer laser micromachining

Fabrication of three-dimensional inductor coil using excimer laser micromachining

New Method to Fabrication 3D Micro-Device Structures

Nano/microfabrication of three-dimensional device structures using a multilayered mould approach

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